DESCRIPTION:
G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials and fillers. G6E-SG™ epoxy has good electrical conductivity. A heating oven is recommended for faster curing times. Uses for G6E-SG™ epoxy include photovoltaic cells, EMI / RFI shielding, medical device assembly and repair, etc.
FEATURES:
· Silver-Graphene Filled (Non-Magnetic)
· Excellent Electrical Conductivity
· Resistant to Temperature Variations
· Graphene Loaded (Improves Cracking Resistance)
· Wide Temperature Operation (Cracking Resistant)
· Room Temperature / Oven Curable (depending upon desired cure time)
TYPICAL APPLICATIONS:
· Photovoltaic (Solar) Cells
· Casting, Coating & Encapsulation
· EMI / RFI Shielding
· Display Packaging / Bonding
· Temperature Sensitive Electronics
· Medical Devices / Sensors
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM:
Part A – smooth thixotropic silver paste
Part B – smooth thixotropic silver paste
MIX RATIO: 100 (Part A) to 50 (Part B) by weight.
POT LIFE: 3 hours
CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 24 hours @ 25°C / 77°F
3 hours @ 80°C / 176°F
1 hour @ 150°C / 302°F
DENSITY: Part A 3.1 – 3.2 g/cm3
Part B 3.0 – 3.2 g/cm3
MIXED VISCOSITY: 110 to 120 Pa·s @ 25°C / 77°F
GLASS TRANSITION TEMPERATURE (Tg): 90°C / 194°F
HARDNESS, SHORE: >70 D
VOLUME RESISTIVITY: ~0.0001 ω·cm
DESCRIPTION:
G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials and fillers. G6E-SG™ epoxy has good electrical conductivity. A heating oven is recommended for faster curing times. Uses for G6E-SG™ epoxy include photovoltaic cells, EMI / RFI shielding, medical device assembly and repair, etc.
FEATURES:
· Silver-Graphene Filled (Non-Magnetic)
· Excellent Electrical Conductivity
· Resistant to Temperature Variations
· Graphene Loaded (Improves Cracking Resistance)
· Wide Temperature Operation (Cracking Resistant)
· Room Temperature / Oven Curable (depending upon desired cure time)
TYPICAL APPLICATIONS:
· Photovoltaic (Solar) Cells
· Casting, Coating & Encapsulation
· EMI / RFI Shielding
· Display Packaging / Bonding
· Temperature Sensitive Electronics
· Medical Devices / Sensors
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM:
Part A – smooth thixotropic silver paste
Part B – smooth thixotropic silver paste
MIX RATIO: 100 (Part A) to 50 (Part B) by weight.
POT LIFE: 3 hours
CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 24 hours @ 25°C / 77°F
3 hours @ 80°C / 176°F
1 hour @ 150°C / 302°F
DENSITY: Part A 3.1 – 3.2 g/cm3
Part B 3.0 – 3.2 g/cm3
MIXED VISCOSITY: 110 to 120 Pa·s @ 25°C / 77°F
GLASS TRANSITION TEMPERATURE (Tg): 90°C / 194°F
HARDNESS, SHORE: >70 D
VOLUME RESISTIVITY: ~0.0001 Ω·cm
