G6 Epoxy ROOM TEMPERATURE CURABLE SILVER-GRAPHENE ELECTRICALLY CONDUCTIVE EPOXY G6E-RTSG

DESCRIPTION: G6E-RTSG™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG™ epoxy is also formulated with proprietary nanomaterials and fillers to provide low electrical resistivity. G6E-RTSG™ epoxy also incorporates a proprietary graphene additive to enhance the crack resistance of the epoxy adhesive. G6E-RTSG™ epoxy has outstanding electrical conductivity and is ideal for applications involving manufacture or repair of conductive and temperature sensitive components. Uses for G6E-RTSG™ epoxy include cold solder replacement applications, printed circuit board, EMI / RFI shielding assembly/repair, etc. FEATURES: · Room Temperature Curable · Excellent Electrical Conductivity · Graphene Loaded (Improves Cracking Resistance) · Wide Temperature Operation (Cracking Resistant) TYPICAL APPLICATIONS: · EMI / RFI Shielding · PCB Manufacture / Repair · Photovoltaic Cell Packaging · Temperature Sensitive Electronics Bonding · Household Electronics Repair · Display Packaging / Bonding SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth thixotropic silver paste Part B – smooth thixotropic silver paste MIX RATIO: 100 (Part A) to 20 (Part B) by weight. POT LIFE: 15 min CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 4 hours @ 25°C / 77°F 30 minutes @ 60°C / 140°F 10 minutes @ 150°C / 302°F DENSITY: Part A 3.1 – 3.2 g/cm3 Part B 3.0 – 3.2 g/cm3 MIXED VISCOSITY: 440 Pa·s @ 25°C / 77°F 93 Pa·s @ 50°C / 122°F TACK-FREE TIME: 1 hour GLASS TRANSITION TEMPERATURE (Tg): 96°C / 205°F (when cured at 60°C / 140°F) HARDNESS, SHORE: >85 D VOLUME RESISTIVITY: 0.003 ω·cm when cured at Room Temperature 0.0001 ω·cm when cured at 150°C / 302°F