G6 Epoxy ROOM TEMPERATURE CURABLE SILVER-GRAPHENE ELECTRICALLY CONDUCTIVE EPOXY G6E-RTSG

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ROOM TEMPERATURE CURABLE SILVER-GRAPHENE ELECTRICALLY CONDUCTIVE EPOXY - G6E-RTSG - G6 Epoxy
Ronkonkoma, NY, United States
ROOM TEMPERATURE CURABLE SILVER-GRAPHENE ELECTRICALLY CONDUCTIVE EPOXY G6E-RTSG
DESCRIPTION: G6E-RTSG™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG™ epoxy is also formulated with proprietary nanomaterials and fillers to provide low electrical resistivity. G6E-RTSG™ epoxy also incorporates a proprietary graphene additive to enhance the crack resistance of the epoxy adhesive. G6E-RTSG™ epoxy has outstanding electrical conductivity and is ideal for applications involving manufacture or repair of conductive and temperature sensitive components. Uses for G6E-RTSG™ epoxy include cold solder replacement applications, printed circuit board, EMI / RFI shielding assembly/repair, etc. FEATURES: · Room Temperature Curable · Excellent Electrical Conductivity · Graphene Loaded (Improves Cracking Resistance) · Wide Temperature Operation (Cracking Resistant) TYPICAL APPLICATIONS: · EMI / RFI Shielding · PCB Manufacture / Repair · Photovoltaic Cell Packaging · Temperature Sensitive Electronics Bonding · Household Electronics Repair · Display Packaging / Bonding SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth thixotropic silver paste Part B – smooth thixotropic silver paste MIX RATIO: 100 (Part A) to 20 (Part B) by weight. POT LIFE: 15 min CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 4 hours @ 25°C / 77°F 30 minutes @ 60°C / 140°F 10 minutes @ 150°C / 302°F DENSITY: Part A 3.1 – 3.2 g/cm3 Part B 3.0 – 3.2 g/cm3 MIXED VISCOSITY: 440 Pa·s @ 25°C / 77°F 93 Pa·s @ 50°C / 122°F TACK-FREE TIME: 1 hour GLASS TRANSITION TEMPERATURE (Tg): 96°C / 205°F (when cured at 60°C / 140°F) HARDNESS, SHORE: >85 D VOLUME RESISTIVITY: 0.003 ω·cm when cured at Room Temperature 0.0001 ω·cm when cured at 150°C / 302°F

DESCRIPTION:

G6E-RTSG™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG™ epoxy is also formulated with proprietary nanomaterials and fillers to provide low electrical resistivity. G6E-RTSG™ epoxy also incorporates a proprietary graphene additive to enhance the crack resistance of the epoxy adhesive.

G6E-RTSG™ epoxy has outstanding electrical conductivity and is ideal for applications involving manufacture or repair of conductive and temperature sensitive components. Uses for G6E-RTSG™ epoxy include cold solder replacement applications, printed circuit board, EMI / RFI shielding assembly/repair, etc.

FEATURES:

· Room Temperature Curable

· Excellent Electrical Conductivity

· Graphene Loaded (Improves Cracking Resistance)

· Wide Temperature Operation (Cracking Resistant)

TYPICAL APPLICATIONS:

· EMI / RFI Shielding

· PCB Manufacture / Repair

· Photovoltaic Cell Packaging

· Temperature Sensitive Electronics Bonding

· Household Electronics Repair

· Display Packaging / Bonding

SPECIFICATIONS:

TWO COMPONENT SYSTEM:

Part A – smooth thixotropic silver paste

Part B – smooth thixotropic silver paste

MIX RATIO: 100 (Part A) to 20 (Part B) by weight.

POT LIFE: 15 min

CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:

4 hours @ 25°C / 77°F

30 minutes @ 60°C / 140°F

10 minutes @ 150°C / 302°F

DENSITY: Part A 3.1 – 3.2 g/cm3

Part B 3.0 – 3.2 g/cm3

MIXED VISCOSITY: 440 Pa·s @ 25°C / 77°F

93 Pa·s @ 50°C / 122°F

TACK-FREE TIME: 1 hour

GLASS TRANSITION TEMPERATURE (Tg): 96°C / 205°F (when cured at 60°C / 140°F)

HARDNESS, SHORE: >85 D

VOLUME RESISTIVITY:

0.003 Ω·cm when cured at Room Temperature

0.0001 Ω·cm when cured at 150°C / 302°F

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Technical Specifications

  G6 Epoxy
Product Category Specialty Adhesives, Sealants, and Compounds
Product Number G6E-RTSG
Product Name ROOM TEMPERATURE CURABLE SILVER-GRAPHENE ELECTRICALLY CONDUCTIVE EPOXY
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture/Repair, Photovoltaic Cell Packaging, Temperature Sensitive Electronics Bonding, Display Packaging/Bonding
Viscosity 93000 to 440000 cP
Composition Filled
Use Temperature 77 to 302 F (25 to 150 C)
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