DESCRIPTION:
G6E-FXNS™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS™ is developed based on advanced proprietary technology that requires 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-FXNS™ less prone to fracture, thus allowing for stronger adhesion to the target substrate. A heating oven is required for curing. Uses for G6E-FXNS™ epoxy include flexible circuits, medical sensor assembly and repair, etc.
FEATURES:
· Flexible (after curing)
· Silver-Carbon Filled (Non-Magnetic)
· Very Good Electrical Conductivity
· Resistant to Temperature Variations
· Impact / Shock Resistant
· Corrosion Resistant
TYPICAL APPLICATIONS:
· Wearable Electronics
· Medical Sensors
· Fiber-Optics Packaging
· Flexible Electronics, Wiring & Harnesses
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM:
Part A – smooth dark grey paste
Part B – smooth thixotropic silver paste
MIX RATIO: 100 (Part A) to 100 (Part B) by weight.
POT LIFE: 1 hour
CURING SCHEDULE: Best results are obtained when product is cured at 1 hour @ 150°C / 302°F
DENSITY: Part A 2.15-2.30 g/cm3
Part B 2.30-2.40 g/cm3
MIXED VISCOSITY: 210 to 220 Pa·s @ 25°C / 77°F
GLASS TRANSITION TEMPERATURE (Tg): 26°C / 79°F
HARDNESS, SHORE: >75 A
VOLUME RESISTIVITY: 0.003 ω· cm
DESCRIPTION:
G6E-FXNS™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS™ is developed based on advanced proprietary technology that requires 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-FXNS™ less prone to fracture, thus allowing for stronger adhesion to the target substrate. A heating oven is required for curing. Uses for G6E-FXNS™ epoxy include flexible circuits, medical sensor assembly and repair, etc.
FEATURES:
· Flexible (after curing)
· Silver-Carbon Filled (Non-Magnetic)
· Very Good Electrical Conductivity
· Resistant to Temperature Variations
· Impact / Shock Resistant
· Corrosion Resistant
TYPICAL APPLICATIONS:
· Wearable Electronics
· Medical Sensors
· Fiber-Optics Packaging
· Flexible Electronics, Wiring & Harnesses
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM:
Part A – smooth dark grey paste
Part B – smooth thixotropic silver paste
MIX RATIO: 100 (Part A) to 100 (Part B) by weight.
POT LIFE: 1 hour
CURING SCHEDULE: Best results are obtained when product is cured at 1 hour @ 150°C / 302°F
DENSITY: Part A 2.15-2.30 g/cm3
Part B 2.30-2.40 g/cm3
MIXED VISCOSITY: 210 to 220 Pa·s @ 25°C / 77°F
GLASS TRANSITION TEMPERATURE (Tg): 26°C / 79°F
HARDNESS, SHORE: >75 A
VOLUME RESISTIVITY: 0.003 Ω· cm
