G6 Epoxy FLEXIBLE SILVER-CARBON ELECTRICALLY CONDUCTIVE EPOXY G6E-FXNS

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FLEXIBLE SILVER-CARBON ELECTRICALLY CONDUCTIVE EPOXY - G6E-FXNS - G6 Epoxy
Ronkonkoma, NY, United States
FLEXIBLE SILVER-CARBON ELECTRICALLY CONDUCTIVE EPOXY G6E-FXNS
DESCRIPTION: G6E-FXNS™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS™ is developed based on advanced proprietary technology that requires 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-FXNS™ less prone to fracture, thus allowing for stronger adhesion to the target substrate. A heating oven is required for curing. Uses for G6E-FXNS™ epoxy include flexible circuits, medical sensor assembly and repair, etc. FEATURES: · Flexible (after curing) · Silver-Carbon Filled (Non-Magnetic) · Very Good Electrical Conductivity · Resistant to Temperature Variations · Impact / Shock Resistant · Corrosion Resistant TYPICAL APPLICATIONS: · Wearable Electronics · Medical Sensors · Fiber-Optics Packaging · Flexible Electronics, Wiring & Harnesses · Solder Replacement SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth dark grey paste Part B – smooth thixotropic silver paste MIX RATIO: 100 (Part A) to 100 (Part B) by weight. POT LIFE: 1 hour CURING SCHEDULE: Best results are obtained when product is cured at 1 hour @ 150°C / 302°F DENSITY: Part A 2.15-2.30 g/cm3 Part B 2.30-2.40 g/cm3 MIXED VISCOSITY: 210 to 220 Pa·s @ 25°C / 77°F GLASS TRANSITION TEMPERATURE (Tg): 26°C / 79°F HARDNESS, SHORE: >75 A VOLUME RESISTIVITY: 0.003 ω· cm
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Technical Specifications

  G6 Epoxy
Product Category Specialty Adhesives, Sealants, and Compounds
Product Number G6E-FXNS
Product Name FLEXIBLE SILVER-CARBON ELECTRICALLY CONDUCTIVE EPOXY
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
Viscosity 210000 to 220000 cP
Composition Filled
Use Temperature 302 F (150 C)
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