DESCRIPTION:
G6E-HTC™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. This epoxy is low cost as compared to high temperature silver epoxy. Curing of G6E-HTC™ epoxy requires a heating oven. Uses for G6E-HTC™ epoxy include casting, coating, encapsulation, grounding, medical device manufacture and repair, etc.
FEATURES:
· Higher Glass Transition & Operating Temperature
· Carbon Filled (Non-Metallic & Non-Magnetic)
· Low-Cost (as an alternative to silver-based epoxies)
· Electrically Conductive
· Low Density
· Corrosion Resistant TYPICAL APPLICATIONS:
· Casting, Coating & Encapsulation
· Grounding such as Electrostatic Discharge (ESD)
· Automotive, Aerospace & Defense Industries
· Soldering Replacement
· EMI / RFI Shielding
· Medical Devices
SPECIFICATIONS:
TWO COMPONENT SYSTEM: Part A – smooth black paste
Part B – smooth black paste
MIX RATIO: 100 (Part A) to 80 (Part B) by weight.
POT LIFE: 4 hours
CURING SCHEDULE: Best results are obtained when product is cured at 4 hours @ 150°C / 302°F. Post cure for 1-2 hours @ 180°C / 356°F for optimum properties.
DENSITY: Part A 1.0 – 1.1 g/cm3
Part B 1.0 – 1.1 g/cm3
MIXED VISCOSITY: 420 Pa·s @ 25°C / 77°F
18 Pa·s @ 80°C / 176°F
OPERATING TEMPERATURE: up to 315°C / 599°F
GLASS TRANSITION TEMPERATURE (Tg): 142°C / 288°F
HARDNESS, SHORE: >85 D
VOLUME RESISTIVITY: ~15 ω· cm
DESCRIPTION:
G6E-HTC™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. This epoxy is low cost as compared to high temperature silver epoxy. Curing of G6E-HTC™ epoxy requires a heating oven. Uses for G6E-HTC™ epoxy include casting, coating, encapsulation, grounding, medical device manufacture and repair, etc.
FEATURES:
· Higher Glass Transition & Operating Temperature
· Carbon Filled (Non-Metallic & Non-Magnetic)
· Low-Cost (as an alternative to silver-based epoxies)
· Electrically Conductive
· Low Density
· Corrosion Resistant
TYPICAL APPLICATIONS:
· Casting, Coating & Encapsulation
· Grounding such as Electrostatic Discharge (ESD)
· Automotive, Aerospace & Defense Industries
· Soldering Replacement
· EMI / RFI Shielding
· Medical Devices
SPECIFICATIONS:
TWO COMPONENT SYSTEM: Part A – smooth black paste
Part B – smooth black paste
MIX RATIO: 100 (Part A) to 80 (Part B) by weight.
POT LIFE: 4 hours
CURING SCHEDULE: Best results are obtained when product is cured at 4 hours @ 150°C / 302°F. Post cure for 1-2 hours @ 180°C / 356°F for optimum properties.
DENSITY: Part A 1.0 – 1.1 g/cm3
Part B 1.0 – 1.1 g/cm3
MIXED VISCOSITY: 420 Pa·s @ 25°C / 77°F
18 Pa·s @ 80°C / 176°F
OPERATING TEMPERATURE: up to 315°C / 599°F
GLASS TRANSITION TEMPERATURE (Tg): 142°C / 288°F
HARDNESS, SHORE: >85 D
VOLUME RESISTIVITY: ~15 Ω· cm
