G6 Epoxy HIGH TEMPERATURE CARBON-FILLED ELECTRICALLY CONDUCTIVE EPOXY G6E-HTC

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HIGH TEMPERATURE CARBON-FILLED ELECTRICALLY CONDUCTIVE EPOXY - G6E-HTC - G6 Epoxy
Ronkonkoma, NY, United States
HIGH TEMPERATURE CARBON-FILLED ELECTRICALLY CONDUCTIVE EPOXY G6E-HTC
DESCRIPTION: G6E-HTC™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. This epoxy is low cost as compared to high temperature silver epoxy. Curing of G6E-HTC™ epoxy requires a heating oven. Uses for G6E-HTC™ epoxy include casting, coating, encapsulation, grounding, medical device manufacture and repair, etc. FEATURES: · Higher Glass Transition & Operating Temperature · Carbon Filled (Non-Metallic & Non-Magnetic) · Low-Cost (as an alternative to silver-based epoxies) · Electrically Conductive · Low Density · Corrosion Resistant TYPICAL APPLICATIONS: · Casting, Coating & Encapsulation · Grounding such as Electrostatic Discharge (ESD) · Automotive, Aerospace & Defense Industries · Soldering Replacement · EMI / RFI Shielding · Medical Devices SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth black paste Part B – smooth black paste MIX RATIO: 100 (Part A) to 80 (Part B) by weight. POT LIFE: 4 hours CURING SCHEDULE: Best results are obtained when product is cured at 4 hours @ 150°C / 302°F. Post cure for 1-2 hours @ 180°C / 356°F for optimum properties. DENSITY: Part A 1.0 – 1.1 g/cm3 Part B 1.0 – 1.1 g/cm3 MIXED VISCOSITY: 420 Pa·s @ 25°C / 77°F 18 Pa·s @ 80°C / 176°F OPERATING TEMPERATURE: up to 315°C / 599°F GLASS TRANSITION TEMPERATURE (Tg): 142°C / 288°F HARDNESS, SHORE: >85 D VOLUME RESISTIVITY: ~15 ω· cm
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Technical Specifications

  G6 Epoxy
Product Category Specialty Adhesives, Sealants, and Compounds
Product Number G6E-HTC
Product Name HIGH TEMPERATURE CARBON-FILLED ELECTRICALLY CONDUCTIVE EPOXY
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation
Viscosity 18000 to 420000 cP
Composition Filled
Use Temperature 600 F (316 C)
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