MicroSense, LLC Datasheets for Semiconductor Metrology Instruments
Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.
Semiconductor Metrology Instruments: Learn more
| Product Name | Notes |
|---|---|
| Automated Thickness measurement system Cassette to cassette or manual loading. Patented sensing technology with APBP (dual automated positioning backpressure probes). Manual Loading 20mm resolution Wafer 2" to 12" (50 to... | |
| Automated Thickness measurement system IR interferometry probe technology. Single or dual probes. Manual Loading 0.5um accuracy. 0.1um resolution Wafer 4" to 12" (100 to 300mm) round or square Thickness range:... | |
| Automated Wafer Thickness Measurement System Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 4” to 12” (100 to 300mm)... | |
| Benchtop, automated Thickness measurement systems Cassette to cassette or manual loading Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 2” to 4” (50 to 100mm). | |
| Benchtop, Manual Thickness measurement system Patented sensing technology with APBP (dual automated positioning backpressure probes) (20nm resolution). Samples 2” to 12” (50 to 300mm) Thickness range: 20um to 5mm Automated... | |
| Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm. Dual white light chromatic coding probe... | |
| The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. | |
| The SigmaTech UltraMap-TSV system is the world’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back... |