Automated Wafer Thickness Measurement System
Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution)
Wafer 4” to 12” (100 to 300mm)
Thickness range: 50um to 3mm
Extended warpage range up to 5mm
Throughput up to 120 wafers / hour
2D & 3D mapping capability
Full SECS/GEM compatibility
Automated calibration
Options
Edge gripper/non-contact handling
Extended warp/bow range up to 5000um
Wafer prealigner
Roughness measurement
Applications
High volume wafer production control, backgrinding control, Wafer characterization, extreme warp wafers, ultrathin wafers thickness mapping
Automated Wafer Thickness Measurement System
Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution)
- Wafer 4” to 12” (100 to 300mm)
- Thickness range: 50um to 3mm
- Extended warpage range up to 5mm
- Throughput up to 120 wafers / hour
- 2D & 3D mapping capability
- Full SECS/GEM compatibility
- Automated calibration
Options
- Edge gripper/non-contact handling
- Extended warp/bow range up to 5000um
- Wafer prealigner
- Roughness measurement
Applications
High volume wafer production control, backgrinding control, Wafer characterization, extreme warp wafers, ultrathin wafers thickness mapping
