The SigmaTech UltraMap-TSV system is the world’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer—up to 300mm in diameter.
The UltraMap-TSV system can be offered in class-1 compatible configuration and can also be provided with FOUP or SMIF wafer handlers.
Fully automated TSV and trench measurement
Auto-fiducial finding and pattern recognition
Class 1 compatible
Measurement from both top and bottom sides of the wafer
Individual features or fields of features, down to 1 micron across
Filled or unfilled TSVs can be measured
Full wafer mapping of TSV or Trench depth uniformity
Non Contact
Non Destructive
The SigmaTech UltraMap-TSV system is the world’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer—up to 300mm in diameter.
The UltraMap-TSV system can be offered in class-1 compatible configuration and can also be provided with FOUP or SMIF wafer handlers.
- Fully automated TSV and trench measurement
- Auto-fiducial finding and pattern recognition
- Class 1 compatible
- Measurement from both top and bottom sides of the wafer
- Individual features or fields of features, down to 1 micron across
- Filled or unfilled TSVs can be measured
- Full wafer mapping of TSV or Trench depth uniformity
- Non Contact
- Non Destructive
