MicroSense, LLC Datasheets for Wafer and Thin Film Instrumentation

Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing.
Wafer and Thin Film Instrumentation: Learn more

Product Name Notes
SigmaTech Wafer Metrology Systems -- UltraMap-APBP Automated Thickness measurement system Cassette to cassette or manual loading. Patented sensing technology with APBP (dual automated positioning backpressure probes). Manual Loading 20mm resolution Wafer 2" to 12" (50 to...
SigmaTech Wafer Metrology Systems -- UltraMap-300IR Automated Thickness measurement system IR interferometry probe technology. Single or dual probes. Manual Loading 0.5um accuracy. 0.1um resolution Wafer 4" to 12" (100 to 300mm) round or square Thickness range:...
SigmaTech Wafer Metrology Systems -- UltraMap-300 Automated Wafer Thickness Measurement System Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 4” to 12” (100 to 300mm)...
SigmaTech Wafer Metrology Systems -- UltraMap-100B Benchtop, automated Thickness measurement systems Cassette to cassette or manual loading Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution) Wafer 2” to 4” (50 to 100mm).
SigmaTech Wafer Metrology Systems -- UltraMap-9600M Benchtop, Manual Thickness measurement system Patented sensing technology with APBP (dual automated positioning backpressure probes) (20nm resolution). Samples 2” to 12” (50 to 300mm) Thickness range: 20um to 5mm Automated...
SigmaTech Wafer Metrology Systems -- UltraMap-200B Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm. Dual white light chromatic coding probe...
Polar Kerr System for MRAM The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM.
SigmaTech Wafer Metrology Systems -- UltraMap-TSV The SigmaTech UltraMap-TSV system is the world’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back...