MicroSense, LLC SigmaTech Wafer Metrology Systems UltraMap-9600M

Description
Benchtop, Manual Thickness measurement system Patented sensing technology with APBP (dual automated positioning backpressure probes) (20nm resolution). Samples 2” to 12” (50 to 300mm) Thickness range: 20um to 5mm Automated calibration All materials, all type of surfaces Options Dual probes Vacuum chuck for ultrathin samples Applications QA and QC of any type of samples, any shape, any thickness range.R&D labs, thickness control after backgrinding.
  • SigmaTech Wafer Metrology Systems - UltraMap-9600M - MicroSense, LLC
    MicroSense, LLC
Description
Benchtop, Manual Thickness measurement system Patented sensing technology with APBP (dual automated positioning backpressure probes) (20nm resolution). Samples 2” to 12” (50 to 300mm) Thickness range: 20um to 5mm Automated calibration All materials, all type of surfaces Options Dual probes Vacuum chuck for ultrathin samples Applications QA and QC of any type of samples, any shape, any thickness range.R&D labs, thickness control after backgrinding.

Suppliers

Company
Product
Description
Supplier Links
SigmaTech Wafer Metrology Systems - UltraMap-9600M - MicroSense, LLC
MicroSense, LLC
Lowell, MA, USA
SigmaTech Wafer Metrology Systems
UltraMap-9600M
SigmaTech Wafer Metrology Systems UltraMap-9600M
Benchtop, Manual Thickness measurement system Patented sensing technology with APBP (dual automated positioning backpressure probes) (20nm resolution). Samples 2” to 12” (50 to 300mm) Thickness range: 20um to 5mm Automated calibration All materials, all type of surfaces Options Dual probes Vacuum chuck for ultrathin samples Applications QA and QC of any type of samples, any shape, any thickness range.R&D labs, thickness control after backgrinding.

Benchtop, Manual Thickness measurement system

Patented sensing technology with APBP (dual automated positioning backpressure probes) (20nm resolution).

  • Samples 2” to 12” (50 to 300mm)
  • Thickness range: 20um to 5mm
  • Automated calibration
  • All materials, all type of surfaces

Options

  • Dual probes
  • Vacuum chuck for ultrathin samples

Applications

QA and QC of any type of samples, any shape, any thickness range.R&D labs, thickness control after backgrinding.

Supplier's Site

Technical Specifications

  MicroSense, LLC
Product Category Wafer and Thin Film Instrumentation
Product Number UltraMap-9600M
Product Name SigmaTech Wafer Metrology Systems
Form Factor Monitor or instrument
Mounting / Loading Manual loading
Technology Automated Positioning Backpressure Probe (APBP)
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