Benchtop, automated Thickness measurement systems
Cassette to cassette or manual loading
Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution)
Wafer 2” to 4” (50 to 100mm). Thickness range: 50um to 3mm
Throughput up to 100W/hours
2D & 3D mapping capability
SECS/GEM communication. Automated calibration.
Options
Wafer prealigner
HISCAN for Roughness and structures measurement
Applications
QA and QC of small size wafers, SiC, Sapphire, Glass, InP, etc…
Benchtop, automated Thickness measurement systems
- Cassette to cassette or manual loading
- Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution)
- Wafer 2” to 4” (50 to 100mm). Thickness range: 50um to 3mm
- Throughput up to 100W/hours
- 2D & 3D mapping capability
- SECS/GEM communication. Automated calibration.
Options
- Wafer prealigner
- HISCAN for Roughness and structures measurement
Applications
QA and QC of small size wafers, SiC, Sapphire, Glass, InP, etc…
