MicroSense, LLC SigmaTech Wafer Metrology Systems UltraMap-200B

Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm. Dual white light chromatic coding probe technology with 10nm resolution Thickness range from 50um to 1mm Automated calibration Hiscan option for surface roughness and link profile measurement and other surface structures Applications Solar Wafers QA and QC, Cost effective, compact metrology tool for R&D labs for all type of wafers and surfaces.