Automated Thickness measurement system
Cassette to cassette or manual loading. Patented sensing technology with APBP (dual automated positioning backpressure probes).
Manual Loading
20mm resolution
Wafer 2" to 12" (50 to 300mm) round or square
Thickness range: 200um to 5mm
Automated calibration
2D & 3D mapping capability
SECS/GEM communication
Options
Extended warp/bow range up to 5000um
Wafer prealigner
Samples with special shape (square, rectangle, round)
Applications
Thickness and shape measurement of wafers made of special materials: ceramics, rough material, plastics, glass, packaging material. Extremely high warp/bow wafers (10mm range).
Automated Thickness measurement system
Cassette to cassette or manual loading. Patented sensing technology with APBP (dual automated positioning backpressure probes).
Manual Loading
- 20mm resolution
- Wafer 2" to 12" (50 to 300mm) round or square
- Thickness range: 200um to 5mm
- Automated calibration
- 2D & 3D mapping capability
- SECS/GEM communication
Options
- Extended warp/bow range up to 5000um
- Wafer prealigner
- Samples with special shape (square, rectangle, round)
Applications
Thickness and shape measurement of wafers made of special materials: ceramics, rough material, plastics, glass, packaging material. Extremely high warp/bow wafers (10mm range).
