Heat Sinks Datasheets

Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel.
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Heat Sinks Datasheets From:
Headquarters
Heilind Electronics, Inc.
United States
Rego Electronics Inc.
Taiwan
Richardson RFPD
United States
RS Components, Ltd.
United Kingdom
Sensata Technologies
Attleboro, MA
Tempco Electric Heater Corporation
United States
ToneCooling Technology Co., Ltd
China
TPS Elektronik GmbH
Germany
Win Source Electronics
United States
Amphenol Communications Solutions
United States
TDK-Lambda Americas Inc.
United States
Airflow/Y.S. Tech, Inc.
Garden Grove, CA
Applied Diamond, Inc.
Wilmington, DE
ArKco Sales, Inc.
Mahtomedi, MN
Boyd
United States
Broadband TelCom Power, Inc.
Santa Ana, CA
Cooliance
Warwick, RI
CoorsTek
Golden, CO
Corsair Memory
Fremont, CA
Dynatron Corp.
Fremont, CA
Ecopower Inc.
Canada
Galco Industrial Electronics
United States
LCSC Electronics Technology (HK) Limited
China
Littelfuse, Inc.
United States
Mi-Tech Metals
Indianapolis, IN
Ohmite Manufacturing Co.
United States
Plansee SE
Austria
PUI - Projections Unlimited, Inc.
United States
Qnnect, formerly Hermetic Solutions Group
United States
Sanyo Denki America, Inc.
Torrance, CA
SECO
Italy
TONGYU Technology Co., Ltd.
China
Tucker Engineering, Inc.
Peabody, MA
Utmel Electronic Limited
China
Wanbang Technology (Guangdong Dongguan) Co., LTD.
China
Xoxide
Malvern, PA
Advanced Thermal Solutions, Inc.
United States
AMEC Thermasol
United Kingdom
ASSMANN WSW Components GmbH
Germany
C&H Technology, Inc.
United States
CARLO GAVAZZI Automation Components
Buffalo Grove, IL
Carlo Gavazzi Automation SpA
Italy
COMAIR ROTRON (Shanghai) Fan Company Ltd.
China
CUI Inc.
Tualatin, OR
Delta Electronics (Americas)
Research Triangle Park, NC
DFRobot
China
Essentra Components
Erie, PA
Fischer Electronik
Germany
HS Marston Aerospace Limited
United Kingdom
JARO Thermal, Inc.
United States
KYOCERA AVX Components Corporation
Fountain Inn, SC
Malico, Inc.
Taiwan
Microchip Technology, Inc.
United States
Molex
United States
multicomp PRO
Chicago, IL
Murata Power Solutions
Mansfield, MA
Newark, An Avnet Company
United States
Nidec America Corporation
United States
NTE Electronics, Inc.
United States
NXP Semiconductors
United States
OMRON Automation and Safety
Schaumburg, IL
Priatherm
Italy
SIE Computing Solutions, Inc.
Brockton, MA
Solar Electric Power Association (SEPA)
United States
SSAC
United States
T-Global Technology Co., Ltd.
Taiwan
TDK-Lambda Americas Inc., High Power Division
United States
TE Connectivity ™
Berwyn, PA
TRACO Power North America, Inc.
United States
Wakefield-Vette, Inc.
United States
Wieland MicroCool
Decatur, AL
Z-LASER Optoelektronik GmbH
Germany