IC Interfaces Datasheets

IC interfaces are semiconductor chips that are used to control and manage the sharing of information between devices.
Search By Specification | Manufacturers and Distributors | IC Interfaces: Selection Guide

IC Interfaces Datasheets From:
Headquarters
DigiKey
United States
Finder S.p.A. con unico socio
Italy
ODG (Origin Data Global)
China
Richardson RFPD
United States
RS Components, Ltd.
United Kingdom
WAGO
United States
Win Source Electronics
United States
Advanced Linear Devices, Inc.
United States
Altech Corp.
Flemington, NJ
LIXINC Electronics Co., Limited
China
NKK Switches
United States
Nova Technology(HK) Co.,Ltd
China
SiTime Corporation
United States
STEGO
United States
Acme Chip Technology Co., Limited
China
ams
Austria
Capella Microsystems, Inc.
Santa Clara, CA
Central Components Mfg.
Middlesex, NJ
Data Device Corporation (DDC)
Bohemia, NY
Embedded Data Systems
Lawrenceburg, KY
LCSC Electronics Technology (HK) Limited
China
Lingto Electronic Limited
China
Memsense, LLC
Rapid City, SD
MORNSUN Guangzhou Science & Technology Co., Ltd.
China
Northrop Grumman - Cutting Edge Optronics
United States
Quarktwin Technology Ltd.
China
ROHM Semiconductor GmbH
Germany
Sensor Platforms, Inc.
San Jose, CA
Shenzhen Shengyu Electronics Technology Limited
China
Tradeport Electronics Group
Canada
US Digital
Vancouver, WA
Utmel Electronic Limited
China
VAST STOCK CO., LIMITED
Hong Kong
2Pai Semiconductor (Shanghai) Co. Ltd.
China
3M
United States
Acconeer AB
Sweden
Acura Embedded Systems, Inc.
Canada
Adafruit Industries
United States
Adesto Technologies Corporation, Inc.
United States
Advanced Science and Novel Technology Co., Inc.
United States
Ai-Thinker
China
AIStorm
Houston, TX
Allied Electronics, Inc.
Fort Worth, TX
Alpha & Omega Semiconductor, Ltd.
United States
Altran Magnetics
United States
AMS CAD + CAFM Solutions
United States
Amulet Technologies
United States
Anfield Industries, Inc.
United States
Apacer Memory America, Inc.
United States
Arduino
Italy
ARIES Embedded GmbH
Germany
Asahi Kasei EMD Corporation
Japan
Asahi Kasei Microsystems Co., Ltd. (AKM)
Japan
Astera Labs, Inc.
Santa Clara, CA
Atmel Corporation
United States
Belden Inc.
United States
Belimo Americas
Danbury, CT
BeRex, Inc.
United States
BHW Technologies
China
Bivar, Inc.
United States
Camozzi Automation, Inc.
United States
Cinch Connectivity Solutions
United States
Clairitec
France
Connective Peripherals Pte. Ltd.
Singapore
Conta-Clip, Inc.
United States
Copeland Communications, Inc.
United States
Corebai Microelectronics (Beijing) Co., Ltd.
China
Cosine Nanoelectronics
China
Crouzet
United States
Crydom Corporation
United States
CTS Corporation
United States
Cypress Semiconductor Corp.
United States
Delta Electronics, Inc.
United States
Delta Electronics (Americas)
Research Triangle Park, NC
Deschner Corporation
Santa Ana, CA
DFRobot
China
Dialog Semiconductor
United Kingdom
Dialog Semiconductor USA
Santa Clara, CA
Digilent, Inc.
United States
Digital Six Laboratories Inc.
United States
Digital View Inc.
United States
Distrelec Group AG
Switzerland
Doodle Labs
Singapore
Efficient Power Conversion Corporation
United States
Enclustra GmbH
Switzerland
Epson Electronics America, Inc.
United States
Finisar Corporation
United States
FlexiPanel, Ltd.
United Kingdom
Flip Electronics
United States
Flowline, Inc.
United States
Fremont Micro Devices Corporation
United States
Fuji Electric Global
Japan
Genesys Logic, Inc.
Taiwan
Goford Semiconductor Co., Ltd.
China
Grayhill, Inc.
La Grange, IL
HANSCHIP Semiconductor Co., Ltd.
China
Hittite Microwave Corporation
United States
Huagao Semiconductor Co., Ltd.
China
HUBER+SUHNER AG
Switzerland
ICP DAS USA, Inc.
United States
Industrial Shields
Spain
Innovasic
United States
Interlink Electronics, Inc.
United States
International Business Machines Corp.
United States
IoTize SAS
France
iWave Systems Technologies Pvt. Ltd.
India
IXYS Integrated Circuits Division
United States
Jiangsu Runic Technology Co., Ltd.
Korea
Jorjin Technologies Inc.
Taiwan
JSMicro Semiconductor Co., Ltd.
China
KDG Industrial
United States
Kinetic Technologies
San Jose, CA
KUKA
Sterling Heights, MI
LAPIS Semiconductor
Japan
Lattice, Incorporated
United States
Leshan Radio Company, Ltd.
China
M5Stack
China
Maple Systems, Inc.
United States
Marlin Technologies, Inc.
United States
Marvell Semiconductor, Inc.
United States
Matrix Orbital
Canada
MegaChips Technology America Corporation
United States
Messenko Semiconductor
Taiwan
Mitsubishi Corporation
Japan
Monolithic Power Systems, Inc.
United States
MoSys, Inc.
United States
Moxa Inc.
Brea, CA
Nanjing Micro One Electronics Inc.
China
NetBurner, Inc.
United States
NewHaven Display International, Inc.
United States
NexCOBOT
Taiwan
NI
United States
Nimbelink, LLC
United States
NTE Electronics, Inc.
United States
NuWaves Ltd.
Middletown, OH
NXP Semiconductors France SAS
France
NXP USA, Inc.
Austin, TX
OK International
United States
Omron Electronics Ltd.
United Kingdom
Osensa Innovations Corp.
Canada
Parade Technologies, Inc.
United States
Parallax, Inc.
United States
Pervasive Displays, Inc.
Orinda, CA
Phoenix Contact GmbH & Co. KG
Germany
Pololu Corporation
United States
Pomona Electronics
Everett, WA
Power Integrations, Inc.
United States
Powerex, Inc.
United States
ProTek Devices
Tempe, AZ
pSemi
United States
QuickLogic Corp.
United States
RAKwireless Technology Co., Ltd.
China
RCA
United States
Realtek Semiconductor Corp.
Taiwan
Red Lion Controls, Inc.
United States
RedWave Labs Ltd.
United Kingdon
RF Solutions
New York, NY
RichTek Technology Corporation
Taiwan
RICOH Electronics, Inc.
United States
ROHM Co., Ltd.
Japan
RUNIC Technology Limited
China
Sagrad, Inc.
United States
Samsung Electronics Co., Ltd.
United States
SanDisk Corp.
United States
Sanken Electric Co., Ltd.
Japan
Sanyo Machine America
United States
Schneider Electric
United States
Seiko Epson Corporation
Japan
Shanghai Awinic Technology Co., Ltd.
China
Shanghai Belling Co., Ltd.
China
Shanghai Chipanalog Microelectronics Co., Ltd.
China
Shanghai Siproin Microelectronics Co., Ltd.
China
Shanghai Xinlong Semiconductor Technology Co., Ltd.
China
Shenzhen Haitianxin Microelectronics Co., Ltd.
China
Shenzhen Huaxuanyang Electronic Co., Ltd.
China
ShenZhen SlkorMicro Semicon Co., Ltd.
China
Shenzhen Titan Micro Electronics Co., Ltd.
China
Siemens AG
Germany
Sifam Tinsley UK
United Kingdom
Silergy Corp.
China
Silicon Motion, Inc.
United States
Smart Prototyping
China
Spansion, Inc.
United States
SparkFun Electronics
United States
ST-Ericsson
United States
STMicroelectronics, Inc.
United States
Storm Interface - UK
United Kingdom
Sure Controls, Inc.
United States
Suzhou Novosense Microelectronics Co., Ltd.
China
Synaptics, Inc.
United States
Tagore Technology, Inc.
United States
Taiwan Semiconductor Manufacturing Company, Ltd.
United States
Taizhou Electronics Co., Ltd.
China
Taoglas
Ireland
TDK Corporation
Japan
TE Connectivity ™
Berwyn, PA
TechNexion
Taiwan
Terasic Technologies
Taiwan
Toshiba Imaging Systems Division
Irvine, CA
Toshiba Semiconductor & Storage Products
United States
Trenz Electronic GmbH
Germany
TRINAMIC Motion Control GmbH & Co. KG.
Germany
UDOO
United States
Unisonic Technologies Co., Ltd.
China
uPI Semiconductor Corp.
Taiwan
VBsemi Electronics Co. Ltd.
Taiwan
Vicor Corporation
United States
Vishay Precision Group
United States
Waldom Electronics
Rockford, IL
Western Design Center, Inc. (The)
United States
WINSYSTEMS, INC.
United States
Wintec Industries, Inc.
United States
Wolfson Microelectronics Plc.
United Kingdom
Wurth Elektronik GmbH & Co. KG
Germany
WUXI i-CORE Electronics Co., Ltd
China
Xilinx, Inc.
United States
Zilog
United States