Palomar Technologies, Inc Datasheets for Reflow Ovens
Reflow ovens are used to perform reflow soldering of surface mount electronic components to printed circuit boards (PCB).
Reflow Ovens: Learn more
| Product Name | Notes |
|---|---|
| Overview The SST 1200 is a table top vacuum and pressure furnace designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and... | |
| Overview The SST 3150 is a high vacuum furnace that provides advanced packaging capabilities in vacuum levels as low as 10-7 Torr, and temperatures up to 500°C (1000°C optional). | |
| Overview The SST 3250 is a high vacuum multi-atmosphere furnace that has been designed for soldering and bonding components and wafers up to 8-inch (200 mm) diameter. The system is... | |
| Overview The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and... | |
| Overview The SST 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. Void-free, flux-free solder joints are... | |
| Overview The SST 8301 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. | |
| Overview The SST 8303 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. | |
| he SST 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels... |