he SST 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed offline. The system is used in both production and research environments for flux-free soldering, brazing, annealing, and glass sealing of components and packages for microelectronic applications.
The 3130’s benefits include:
Precise control of soldering process profile
Consistent, highly reliable solder interface
Accurate control of thermal cycles
Ease of use and flexibility of operation
Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components. Glass to Metal Sealing. Glass to metal sealing is performed at high temperatures to create hermetic seals for electrical feedthroughs and electronic components.. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.
Applications
Accelerometers
Atomic clocks
Automotive diodes
Automotive sensors
CPV solar cell modules
Fiber optic devices
Flip chips
GaN MMICs
Gated light arrays
Glass diodes
Glass-to-metal seals
Hearing aid amplifiers
Hermetic feed-throughs
High-accuracy gyroscopes
Implantable medical devices
Laser pump diodes
LED lamps and heaters
MEMS devices
Microwave packages
he SST 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed offline. The system is used in both production and research environments for flux-free soldering, brazing, annealing, and glass sealing of components and packages for microelectronic applications.
The 3130’s benefits include:
- Precise control of soldering process profile
- Consistent, highly reliable solder interface
- Accurate control of thermal cycles
- Ease of use and flexibility of operation
-
Processes
Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices.
Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components. Glass to Metal Sealing. Glass to metal sealing is performed at high temperatures to create hermetic seals for electrical feedthroughs and electronic components.. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.
Applications
- Accelerometers
- Atomic clocks
- Automotive diodes
- Automotive sensors
- CPV solar cell modules
- Fiber optic devices
- Flip chips
- GaN MMICs
- Gated light arrays
- Glass diodes
- Glass-to-metal seals
- Hearing aid amplifiers
- Hermetic feed-throughs
- High-accuracy gyroscopes
- Implantable medical devices
- Laser pump diodes
- LED lamps and heaters
- MEMS devices
- Microwave packages
