Overview
The SST 8303 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. Available with a single or triple chamber, the system allows for heating up to 500°C and fast cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig using the QuikCool™ cooling unit.
Key benefits of the SST 8303 include:
Automated high-volume production vacuum pressure soldering system
Enables low-void solder connections with preforms or with solder paste
Offers maximum flexibility for processing a wide range of solder alloys and other alternative interconnect materials
Each chamber of the SST 8303 runs a complete process allowing multiple processes to be run in parallel
Flexible configuration for any production line: Triple Chamber: SST 8303 (Single Chamber available: SST 8301)
Oxide removal technology using formic acid or forming gas
Automation Robot
The SST 8303 Automated Vacuum Pressure System can operate as a stand-alone unit or can be integrated into an automated production line. A Cartesian gantry system is used to automatically shuttle part carriers in/out of each chamber, performing each movement with high accuracy and precision.
Processes
Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability power modules. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.
Applications
Power Module Assembly
IGBT/SiC/GaAs/GaN Die Attach
Die Attach for Pressure Sensors
Hermetic Sealing of IR Image Sensors
High Power Laser Module Assembly
Multilayer Ceramic Capacitors
High Intensity LED Attach
CPV Solar Cell Assembly
Hermetic Sealing of Hi-Rel Packages
Copper Clip Soldering
Overview
The SST 8303 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. Featuring conveyor belts and a Cartesian gantry, the system provides high volume, high reliable packages through precise control of the soldering process. Available with a single or triple chamber, the system allows for heating up to 500°C and fast cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig using the QuikCool™ cooling unit.
Key benefits of the SST 8303 include:
- Automated high-volume production vacuum pressure soldering system
- Enables low-void solder connections with preforms or with solder paste
- Offers maximum flexibility for processing a wide range of solder alloys and other alternative interconnect materials
- Each chamber of the SST 8303 runs a complete process allowing multiple processes to be run in parallel
- Flexible configuration for any production line: Triple Chamber: SST 8303 (Single Chamber available: SST 8301)
- Oxide removal technology using formic acid or forming gas
Automation Robot
The SST 8303 Automated Vacuum Pressure System can operate as a stand-alone unit or can be integrated into an automated production line. A Cartesian gantry system is used to automatically shuttle part carriers in/out of each chamber, performing each movement with high accuracy and precision.
Processes
Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability power modules.
Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.
Applications
- Power Module Assembly
- IGBT/SiC/GaAs/GaN Die Attach
- Die Attach for Pressure Sensors
- Hermetic Sealing of IR Image Sensors
- High Power Laser Module Assembly
- Multilayer Ceramic Capacitors
- High Intensity LED Attach
- CPV Solar Cell Assembly
- Hermetic Sealing of Hi-Rel Packages
- Copper Clip Soldering
