Palomar Technologies, Inc Vacuum Pressure Furnace SST 5100

Description
Overview The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. An unlimited number of process profiles can easily be created and stored in the controller. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. The system is designed for high production flux-less void-free soldering. Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components. Applications Automotive diodes CPV solar cell modules EMI filters Fiber optic devices Flip chips GaN MMICs Hearing aid amplifiers Hermetic feed-throughs Implantable medical devices Laser pump diodes LED lamps and heaters Microwave packages Miniature crystals MMICs Oscillators Pacemakers Power modules Precision capacitors Resistor networks RF amplifiers Surge suppressors
Description
Overview The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. An unlimited number of process profiles can easily be created and stored in the controller. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. The system is designed for high production flux-less void-free soldering. Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components. Applications Automotive diodes CPV solar cell modules EMI filters Fiber optic devices Flip chips GaN MMICs Hearing aid amplifiers Hermetic feed-throughs Implantable medical devices Laser pump diodes LED lamps and heaters Microwave packages Miniature crystals MMICs Oscillators Pacemakers Power modules Precision capacitors Resistor networks RF amplifiers Surge suppressors

Suppliers

Company
Product
Description
Supplier Links
Vacuum Pressure Furnace - SST 5100 - Palomar Technologies, Inc
Carlsbad, CA, United States
Vacuum Pressure Furnace
SST 5100
Vacuum Pressure Furnace SST 5100
Overview The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. An unlimited number of process profiles can easily be created and stored in the controller. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. The system is designed for high production flux-less void-free soldering. Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components. Applications Automotive diodes CPV solar cell modules EMI filters Fiber optic devices Flip chips GaN MMICs Hearing aid amplifiers Hermetic feed-throughs Implantable medical devices Laser pump diodes LED lamps and heaters Microwave packages Miniature crystals MMICs Oscillators Pacemakers Power modules Precision capacitors Resistor networks RF amplifiers Surge suppressors

Overview

The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. An unlimited number of process profiles can easily be created and stored in the controller. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. The system is designed for high production flux-less void-free soldering.

Processes

Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices.
Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.

Applications

  • Automotive diodes
  • CPV solar cell modules
  • EMI filters
  • Fiber optic devices
  • Flip chips
  • GaN MMICs
  • Hearing aid amplifiers
  • Hermetic feed-throughs
  • Implantable medical devices
  • Laser pump diodes
  • LED lamps and heaters
  • Microwave packages
  • Miniature crystals
  • MMICs
  • Oscillators
  • Pacemakers
  • Power modules
  • Precision capacitors
  • Resistor networks
  • RF amplifiers
  • Surge suppressors
Supplier's Site

Technical Specifications

  Palomar Technologies, Inc
Product Category Reflow Ovens
Product Number SST 5100
Product Name Vacuum Pressure Furnace
Temperature Range 212 to 932 F (100 to 500 C)
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