Overview
The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. An unlimited number of process profiles can easily be created and stored in the controller. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. The system is designed for high production flux-less void-free soldering.
Processes
Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.
Applications
Automotive diodes
CPV solar cell modules
EMI filters
Fiber optic devices
Flip chips
GaN MMICs
Hearing aid amplifiers
Hermetic feed-throughs
Implantable medical devices
Laser pump diodes
LED lamps and heaters
Microwave packages
Miniature crystals
MMICs
Oscillators
Pacemakers
Power modules
Precision capacitors
Resistor networks
RF amplifiers
Surge suppressors
Overview
The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. An unlimited number of process profiles can easily be created and stored in the controller. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. The system is designed for high production flux-less void-free soldering.
Processes
Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices.
Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.
Applications
- Automotive diodes
- CPV solar cell modules
- EMI filters
- Fiber optic devices
- Flip chips
- GaN MMICs
- Hearing aid amplifiers
- Hermetic feed-throughs
- Implantable medical devices
- Laser pump diodes
- LED lamps and heaters
- Microwave packages
- Miniature crystals
- MMICs
- Oscillators
- Pacemakers
- Power modules
- Precision capacitors
- Resistor networks
- RF amplifiers
- Surge suppressors