Palomar Technologies, Inc Datasheets for Die Bonders
Die bonders permanently attach a semiconductor die or chip to a package or substrate.
Die Bonders: Learn more
| Product Name | Notes |
|---|---|
| Overview Developed for the demanding needs of the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron high precision placement accuracy and speeds up... | |
| Overview Palomar Technologies' 3880 Die Bonder component placement die attach system features a state of the art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest and most reliable... | |
| Overview The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless, and medical... | |
| Overview The Palomar 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Its... | |
| Overview The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder with optional interchangeable clamps for 45-60° and 90° deep access bonding on a single machine. | |
| Overview The SST 8301 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. | |
| Overview The SST 8303 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure. |