Palomar Technologies, Inc Laboratory Vacuum Solder Reflow Station SST 1200

Overview The SST 1200 is a table top vacuum and pressure furnace designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components. The station is easy to use and designed for a wide variety of soldering tasks. A ramping temperature controller is combined with customized programmable logic controller (PLC) to provide automatic process control. The 1200 table top furnace is ideal for small labs and R&D facilities. Void-free solder joints are most reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas. Features Semi-programmable vacuum furnace Creates void-free, flux-free joints Precise heat and cool controls Temperature up to 450°C Vacuum below 100 millitorr Pressure to 50 psig Unlimited process profiles Temperature controller with PLC Single chamber process Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components. Applications Automotive diodes CPV solar cell modules Fiber optic devices Flip chips GaN MMICs Hearing aid amplifiers Hermetic feed-throughs Implantable medical devices Laser pump diodes LED lamps and heaters Microwave packages Miniature crystals MMICs Oscillators Pacemakers Power modules Pressure sensors Resistor networks RF amplifiers