Electronic and IC Packaging Services

Service Detail from Palomar Technologies, Inc

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IC Packaging-Image

Specifications

Company Information
With over 40 years of experience in the industry assembling microelectronic and photonic chip packages, Palomar Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development/optimization, package prototyping, die attach, wire bonding, outsourced package assembly, test, and measurement.
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