Overview
The SST 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.
The 518 benefits include:
Precise control of soldering process profile
Consistent, highly reliable solder interface
Accurate control of thermal cycles
Ease of use and flexibility of operation
Processes
Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices.
Flux Free Solder Process Development
Assembly of High Reliability Microelectronic Packages
Hybrid Microelectronic Circuit Assembly
Fiber Optic Package Assembly
Ceramic Package Sealing
Features
Cooling water chiller and pump
Multiple point temperature recording
Formic acid
Flux trap
Monitoring thermocouplers
Moisture analyzer
Oxygen analyzer
Plotted profile charts
Offline programming
Applications
Accelerometers
Atomic clocks
Automotive diodes
Automotive sensors
CPV solar cell modules
Fiber optic devices
Flip chips
GaN MMICs
Gated light arrays
Glass diodes
Glass-to-metal seals
Hearing aid amplifiers
Hermetic feed-throughs
High accuracy gyroscopes
Implantable medical devices
Laser pump diodes
LED lamps and heaters
MEMS devices
Microwave packages
Overview
The SST 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.
The 518 benefits include:
- Precise control of soldering process profile
- Consistent, highly reliable solder interface
- Accurate control of thermal cycles
- Ease of use and flexibility of operation
Processes
Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices.
- Flux Free Solder Process Development
- Assembly of High Reliability Microelectronic Packages
- Hybrid Microelectronic Circuit Assembly
- Fiber Optic Package Assembly
- Ceramic Package Sealing
Features
- Cooling water chiller and pump
- Multiple point temperature recording
- Formic acid
- Flux trap
- Monitoring thermocouplers
- Moisture analyzer
- Oxygen analyzer
- Plotted profile charts
- Offline programming
Applications
- Accelerometers
- Atomic clocks
- Automotive diodes
- Automotive sensors
- CPV solar cell modules
- Fiber optic devices
- Flip chips
- GaN MMICs
- Gated light arrays
- Glass diodes
- Glass-to-metal seals
- Hearing aid amplifiers
- Hermetic feed-throughs
- High accuracy gyroscopes
- Implantable medical devices
- Laser pump diodes
- LED lamps and heaters
- MEMS devices
- Microwave packages