Development of complex technologies continues to grow at a rapid pace, challenging existing technology giants and start-ups alike to keep pace with the growing demands for higher data capacity, faster speed, smaller designs and more sustainable solutions that are the foundation of the connected world. With today’s rapidly changing technology, time-to-market is one of the most important factors for product success.

With over 40 years of experience in the industry assembling microelectronic and photonic chip packages, Palomar Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development/optimization, package prototyping, die attach, wire bonding, outsourced package assembly, test, and measurement.

Innovation Center applications engineers develop your process in-house or devise a Research & Development partnership. Our goal is to get your new product accepted in the market and prepare it for high volume production.