Sensor Chips Datasheets

Sensor chips are dies incorporating semiconductor circuit elements that are used to convert changes to some physical parameter to an electrical signal.
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Sensor Chips Datasheets From:
Headquarters
ASAP Semiconductor LLC
United States
Churod Americas, Inc.
United States
Dexter Research Center, Inc.
Dexter, MI
EBE Elektro-Bau-Elemente GmbH
Germany
Hamamatsu Photonics
Germany
Hottinger Bruel and Kjaer UK Ltd.
Denmark
Richardson RFPD
United States
Rochester Electronics
United States
Silicon Designs, Inc.
Kirkland, WA
Win Source Electronics
United States
Altech Corp.
Flemington, NJ
Electro Optical Components, Inc.
Santa Rosa, CA
LIXINC Electronics Co., Limited
China
SICK
United States
SiTime Corporation
United States
Skyworks Solutions, Inc.
United States
United Electric Controls Company
United States
Acme Chip Technology Co., Limited
China
All Sensors Corp.
United States
Capella Microsystems, Inc.
Santa Clara, CA
Cirrus Logic, Inc.
Austin, TX
Embedded Data Systems
Lawrenceburg, KY
First Sensor AG
Germany
Kionix, Inc.
Ithaca, NY
LCSC Electronics Technology (HK) Limited
China
Merit Sensor Systems
United States
MultiDimension Technology Co., Ltd.
United States
Owlstone Inc.
Norwalk, CT
ROHM Semiconductor GmbH
Germany
Sensor Platforms, Inc.
San Jose, CA
TOP-electronics USA
United States
Utmel Electronic Limited
China
VAST STOCK CO., LIMITED
Hong Kong
Abracon, LLC
United States
Advanced Photonix
Camarillo, CA
Alliance Memory, Inc.
United States
Allied Electronics, Inc.
Fort Worth, TX
AMS CAD + CAFM Solutions
United States
Asahi Kasei Microsystems Co., Ltd. (AKM)
Japan
AVX Corporation
Fountain Inn, SC
Banner Engineering Corp.
Minneapolis, MN
C-TON Industries
United States
California Eastern Laboratories - CEL
Santa Clara, CA
Carlo Gavazzi Automation SpA
Italy
Cypress Semiconductor Corp.
United States
Datasensor SpA
Italy
Digi International, Inc.
Minnetonka, MN
DLP Design Inc.
United States
EPCOS AG
Germany
Everlight Electronics Co., Ltd.
Taiwan
Everlight International Corp.
United States
Finisar Corporation
United States
Gravitech LLC
United States
Hamamatsu Corporation USA
United States
Hitachi, Ltd.
Japan
Innovative Sensor Technology IST AG
Switzerland
Intersema Sensoric SA
Switzerland
Marvell Semiconductor, Inc.
United States
Messenko Semiconductor
Taiwan
Micron Technology, Inc.
Boise, ID
Microsemi Corp.
United States
Mitsubishi Corporation
Japan
Molex
United States
Monolithic Power Systems, Inc.
United States
Multi-Tech Systems, Inc.
Mounds View, MN
NEC Corporation
United States
Newark, An Avnet Company
United States
NJR Corporation
United States
Ohmite Manufacturing Co.
United States
Omron Electronics Ltd.
United Kingdom
optek-Danulat, Inc.
Germantown, WI
OSRAM GmbH
Germany
Power Integrations, Inc.
United States
Red Lion Controls, Inc.
United States
Samsung Electronics Co., Ltd.
United States
Schneider Electric
United States
Semtech Corp.
Camarillo, CA
Shenzhen Huaxuanyang Electronic Co., Ltd.
China
Shenzhen Newopto Photoelectric Technology Co., Ltd.
China
ShenZhen SlkorMicro Semicon Co., Ltd.
China
Shenzhen XINGLIGHT Technology Co., Ltd.
China
Siemens AG
Germany
Silicon Sensing Systems
United Kingdom
SMARTEC SA
Switzerland
Spansion, Inc.
United States
Taiyo Yuden Co., Ltd.
Japan
Tronics
United States
TURCK Inc.
United States
Wiesemann & Theis GmbH
Germany
Winbond Electronics Corporation America
United States
WUXI i-CORE Electronics Co., Ltd
China
Xilinx, Inc.
United States