Electro Optical Components, Inc. Datasheets for Sensor Chips

Sensor chips are dies incorporating semiconductor circuit elements that are used to convert changes to some physical parameter to an electrical signal.
Sensor Chips: Learn more

Product Name Notes
COB for direct PCB mounting • Castellated holes for easy soldering • High durability for rugged operation • Very high sensitivity • Room temperature operation Flame monitoring • Flame and...
Multi-Pixel detectors consist of 2 to 16 pixels in line or matrix design. The detectors cover a wide spectral range, which is highly relevant for applications in inline or mobile...
Multi-Single-Pixel Array detectors consist of 2 to 16 Single-Pixels in line or matrix design. The detectors cover a wide spectral range, which is highly relevant for applications in inline or...
Silicon Photomultipliers (SiPMs) are silicon-based solid state low level light sensors. They are basically an array of silicon avalanche photo diodes (APDs), each operated in Geiger-mode. This results in the...
The arrays are available in a pitch starting from 50 µm. Further customization is possible. Due to their unique thin-film encapsulation they can be directly wire-bonded to printed circuit boards.
The infrared detectors are available with double encapsulation. The sensors are not only protected by a standard TO package, but also by a novel thin-film encapsulation directly on the chip.
trinamiX bare chip infrared detectors are protected by a thin-film encapsulation. They can be directly wire-bonded to printed circuit boards. Bare chip solutions enable small, flexible and very efficient devices.