IC Interfaces Datasheets

IC interfaces are semiconductor chips that are used to control and manage the sharing of information between devices.
Search By Specification | Manufacturers and Distributors | IC Interfaces: Selection Guide

IC Interfaces Datasheets From:
Headquarters
DigiKey
United States
Finder S.p.A. con unico socio
Italy
LCSC Electronics Technology (HK) Limited
China
Littelfuse, Inc.
United States
Quarktwin Technology Ltd.
China
Richardson RFPD
United States
Rochester Electronics
United States
ROHM Semiconductor GmbH
Germany
RS Components, Ltd.
United Kingdom
Shenzhen Shengyu Electronics Technology Limited
China
Skyworks Solutions, Inc.
United States
Texas Instruments
United States
WAGO
United States
Win Source Electronics
Singapore
Altech Corp.
Flemington, NJ
Belden Inc.
United States
LIXINC Electronics Co., Limited
China
Murata Electronics
United States
Nova Technology(HK) Co.,Ltd
China
SiTime Corporation
United States
STEGO
United States
Acme Chip Technology Co., Limited
China
ams
Austria
Capella Microsystems, Inc.
Santa Clara, CA
Central Components Mfg.
Middlesex, NJ
Data Device Corporation (DDC)
Bohemia, NY
Embedded Data Systems
Lawrenceburg, KY
Integrated Device Technology
San Jose, CA
Karl Kruse GmbH & Co. KG
Germany
Lansdale Semiconductor, Inc.
Phoenix, AZ
Lingto Electronic Limited
China
Linx Technologies
Merlin, OR
Maxim Integrated
San Jose, CA
Memsense, LLC
Rapid City, SD
MORNSUN Guangzhou Science & Technology Co., Ltd.
China
Northrop Grumman - Cutting Edge Optronics
United States
Sensor Platforms, Inc.
San Jose, CA
Tradeport Electronics Group
Canada
US Digital
Vancouver, WA
Utmel Electronic Limited
China
VAST STOCK CO., LIMITED
Hong Kong
2Pai Semiconductor (Shanghai) Co. Ltd.
China
Acconeer AB
Sweden
Acura Embedded Systems, Inc.
Canada
Adesto Technologies Corporation, Inc.
United States
Advanced Linear Devices, Inc.
United States
Advanced Micro Devices, Inc.
Sunnyvale, CA
Advanced Science and Novel Technology Co., Inc.
United States
Advantech
United States
Ai-Thinker
China
AIStorm
Houston, TX
Alcatel-Lucent
France
Allied Electronics, Inc.
Fort Worth, TX
Alpha & Omega Semiconductor, Ltd.
United States
Altran Magnetics
United States
Amazing Microelectronic Corp.
Taiwan
AMCC
France
Ampleon
United States
AMS CAD + CAFM Solutions
United States
Anfield Industries, Inc.
United States
Apacer Memory America, Inc.
United States
Arduino
Italy
ARIES Embedded GmbH
Germany
Asahi Kasei EMD Corporation
Japan
Asahi Kasei Microsystems Co., Ltd. (AKM)
Japan
Astera Labs, Inc.
Santa Clara, CA
Atmel Corporation
United States
Bel Fuse – Circuit Protection
United States
Belimo Americas
Danbury, CT
Bivar, Inc.
United States
Bourns, Inc.
Riverside, CA
Bridgetek Pte Ltd.
Singapore
California Eastern Laboratories - CEL
Santa Clara, CA
Camozzi Automation, Inc.
United States
Chrontel, Inc.
United States
Cinch Connectivity Solutions
United States
Clairitec
France
Connective Peripherals Pte. Ltd.
Singapore
Conta-Clip, Inc.
United States
Copeland Communications, Inc.
United States
Corebai Microelectronics (Beijing) Co., Ltd.
China
Cortina Systems, Inc.
United States
Cosine Nanoelectronics
China
Crouzet
United States
Crydom Corporation
United States
CTS Corporation
United States
Delta Electronics, Inc.
United States
Delta Electronics (Americas)
Research Triangle Park, NC
Deschner Corporation
Santa Ana, CA
DFRobot
China
Dialog Semiconductor
United Kingdom
Dialog Semiconductor USA
Santa Clara, CA
Digi International, Inc.
Minnetonka, MN
Digilent, Inc.
United States
Digital Six Laboratories Inc.
United States
Doodle Labs
Singapore
EM Microelectronic - US, Inc.
United States
Enclustra GmbH
Switzerland
EPSON America, Inc.
United States
Ericsson, Inc.
Plano, TX
Espressif Systems
China
Finisar Corporation
United States
FlexiPanel, Ltd.
United Kingdom
Flip Electronics
United States
Flowline, Inc.
United States
Fremont Micro Devices Corporation
United States
Fuji Electric Global
Japan
Genesys Logic, Inc.
Taiwan
Goford Semiconductor Co., Ltd.
China
HALO Electronics, Inc.
United States
HANSCHIP Semiconductor Co., Ltd.
China
Harris Corporation / RF Communications Division
United States
Hitachi, Ltd.
Japan
Hittite Microwave Corporation
United States
Holtek Semiconductor, Inc.
Taiwan
Honeywell Aerospace
United States
HTC Korea
Korea, South
Huagao Semiconductor Co., Ltd.
China
HUBER+SUHNER AG
Switzerland
IBM Microelectronics
United States
ICP DAS USA, Inc.
United States
Industrial Shields
Spain
Innovasic
United States
Inova Semiconductors GmbH
Germany
Inphi Corporation
United States
iNRCORE USA
Bristol, PA
Integrated Silicon Solution, Inc.
United States
International Business Machines Corp.
United States
Inventus Power
United States
IoTize SAS
France
iWave Systems Technologies Pvt. Ltd.
India
IXYS Corporation
United States
IXYS Integrated Circuits Division
United States
Jiangsu Runic Technology Co., Ltd.
Korea
Jorjin Technologies Inc.
Taiwan
JSMicro Semiconductor Co., Ltd.
China
KDG Industrial
United States
Kinetic Technologies
San Jose, CA
KUKA
Sterling Heights, MI
L3Harris Technologies, Inc.
United States
Laird Connectivity
United States
Lantronix, Inc.
United States
LAPIS Semiconductor
Japan
Laser Components USA, Inc.
United States
Lattice, Incorporated
United States
Lattice Semiconductor Corporation
United States
Leshan Radio Company, Ltd.
China
Lime Microsystems
United Kingdom
Linear Technology (UK) Ltd.
United Kingdom
LSI Computer Systems, Inc.
United States
LSI Logic Corporation
United States
M5Stack
China
Maple Systems, Inc.
United States
Marlin Technologies, Inc.
United States
Marvell Semiconductor, Inc.
United States
Matrix Orbital
Canada
MegaChips Technology America Corporation
United States
Messenko Semiconductor
Taiwan
Micrel, Inc.
United States
Micron Technology, Inc.
Boise, ID
Microsemi Corp.
United States
Mitsubishi Corporation
Japan
MoSys, Inc.
United States
Motorola Solutions, Inc.
United States
Moxa Inc.
Brea, CA
Multi-Tech Systems, Inc.
Mounds View, MN
Murata Power Solutions
Mansfield, MA
Nanjing Micro One Electronics Inc.
China
NEC Corporation
United States
Newark, An Avnet Company
United States
NexCOBOT
Taiwan
Nidec America Corporation
United States
Nimbelink, LLC
United States
NJR Corporation
United States
NTE Electronics, Inc.
United States
NuWaves Ltd.
Middletown, OH
NVE Corporation
Eden Prairie, MN
NXP Semiconductors France SAS
France
NXP USA, Inc.
Austin, TX
OK International
United States
Olimex, Ltd.
Bulgaria
OMRON Automation and Safety
Schaumburg, IL
Omron Electronics Ltd.
United Kingdom
Osensa Innovations Corp.
Canada
Parallax, Inc.
United States
Pericom Semiconductor Corp.
United States
Pervasive Displays, Inc.
Orinda, CA
Phoenix Contact GmbH & Co. KG
Germany
PHOENIX CONTACT USA
Middletown, PA
PLX Technology, Inc.
United States
Pololu Corporation
United States
Pomona Electronics
Everett, WA
Power Integrations, Inc.
United States
ProTek Devices
Tempe, AZ
pSemi
United States
Pulse Electronics Corporation
San Diego, CA
QUALCOMM, Incorporated
San Diego, CA
Quectel Wireless Solutions Co., Ltd.
Canada
QuickLogic Corp.
United States
Radiocrafts AS
Norway
RAKwireless Technology Co., Ltd.
China
Ramtron International Corporation
United States
RCA
United States
Realtek Semiconductor Corp.
Taiwan
Red Lion Controls, Inc.
United States
RedWave Labs Ltd.
United Kingdon
RF Digital Corporation
United States
RF Solutions
New York, NY
Ricoh Corporation
United States
RICOH Electronics, Inc.
United States
ROHM Co., Ltd.
Japan
Royal Philips Electronics
United States
RUNIC Technology Limited
China
Sagrad, Inc.
United States
Samsung Electronics Co., Ltd.
United States
SanDisk Corp.
United States
Sanken Electric Co., Ltd.
Japan
Sanyo Denki America, Inc.
Torrance, CA
Sanyo Machine America
United States
Schneider Electric
United States
Seeed Technology Co., Ltd.
China
Seiko Epson Corporation
Japan
Semikron, Inc.
Hudson, NH
SGS, Inc.
United States
Shanghai Awinic Technology Co., Ltd.
China
Shanghai Belling Co., Ltd.
China
Shanghai Chipanalog Microelectronics Co., Ltd.
China
Shanghai Siproin Microelectronics Co., Ltd.
China
Shanghai Xinlong Semiconductor Technology Co., Ltd.
China
Shenzhen Haitianxin Microelectronics Co., Ltd.
China
Shenzhen Huaxuanyang Electronic Co., Ltd.
China
ShenZhen SlkorMicro Semicon Co., Ltd.
China
Shenzhen Titan Micro Electronics Co., Ltd.
China
Siemens AG
Germany
Sifam Tinsley UK
United Kingdom
Sigma Designs, Inc.
United States
Signetics High Technology, Inc.
United States
Silergy Corp.
China
Silicon Motion, Inc.
United States
Silvertel
United Kingdom
SIMCom Wireless Solutions Limited
China
Smart Prototyping
China
SMSC - Standard Microsystems Corporation
United States
Spansion, Inc.
United States
ST-Ericsson
United States
STMicroelectronics
Switzerland
Storm Interface - UK
United Kingdom
Sure Controls, Inc.
United States
Synaptics, Inc.
United States
Taiwan Semiconductor Co., Ltd.
Taiwan
Taiwan Semiconductor Manufacturing Company, Ltd.
United States
Taizhou Electronics Co., Ltd.
China
TDK Corporation
Japan
TDK InvenSense, Inc.
United States
TE Connectivity ™
Berwyn, PA
TechNexion
Taiwan
Telit
Boca Raton, FL
Terasic Technologies
Taiwan
Texas Instruments Standard Linear and Logic
United States
THAT Corporation
United States
THine Solutions, Inc.
Santa Clara, CA
Torex Semiconductor, Ltd.
Japan
Toshiba Corporation
Japan
Toshiba Imaging Systems Division
Irvine, CA
Toshiba Semiconductor & Storage Products
United States
Trenz Electronic GmbH
Germany
TRINAMIC Motion Control GmbH & Co. KG.
Germany
TTM Technologies Inc.
United States
u-blox AG
Switzerland
UDOO
United States
Union Semiconductor, Inc.
United States
Unisonic Technologies Co., Ltd.
China
uPI Semiconductor Corp.
Taiwan
VarTech Systems
Baton Rouge, LA
VBsemi Electronics Co. Ltd.
Taiwan
Versasense
Belgium
Vicor Corporation
United States
Vishay Precision Group
United States
Waldom Electronics
Rockford, IL
Western Design Center, Inc. (The)
United States
Western Digital Corporation
United States
Winbond Electronics Corporation America
United States
WINSYSTEMS, INC.
United States
Wintec Industries, Inc.
United States
Wolfson Microelectronics Plc.
United Kingdom
Wurth Elektronik GmbH & Co. KG
Germany
WUXI i-CORE Electronics Co., Ltd
China