3M Aerospace and Aircraft Maintenance Division Datasheets for Industrial Sealants

Industrial sealants are liquid or viscous compounds used between surfaces to contain fluids, prevent leaks, and prevent infiltration of unwanted material. They may also include compounds for filling gaps or seams.
Industrial Sealants: Learn more

Product Name Notes
3M™ Edge Sealer ES2000 is a two-part edge sealer. It is a clear, non-yellowing and UV stable, durable sealer system having excellent resistance to environmental and ultra-violet (UV) exposure.
3M™ Scotch-Weld™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core.
3M™ Scotch-Weld™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. High performance over a temperature range of -67F...
3M™ Scotch-Weld™ Core Splice Adhesive Film AF 3002 is a 250-350°F (121-177°C) curing, low density, expandable product designed for the purpose of filling mismatched areas, and for splicing and reinforcing...
3M™ Scotch-Weld™ Core Splice Film AF 3070 FST is a dual-cure 120C or 180C curing, low-density, expandable product for these applications: honeycomb sandwich edge finishing, filling mismatched areas, and core...
3M™ Scotch-Weld™ Structural Adhesive EC-3587 B/A Gray is a two-part polyurethane that cures at room temperature or with heat to a tough, impact-resistant material. It has excellent adhesion to many...
3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3024 is a 250°F (121°C) to 350°F (176°C) curing, low density, expandable core splice adhesive film.High expansion (250%). Low sag during cure. Low...
3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3028 is a 250°F to 350°F (121°C to 176°C) curing, low density, expandable core splice adhesive film. Scotch-Weld AF 3028 adhesive was designed...
3M™ Scotch-Weld™ Structural Void Filling Compound 3439 HT is a temperature-resistant, one-part, high-temperature curing low density void filling compound.
3M™ Scotch-Weld™ Void Filling and Edge Sealing Compound EC-3524 B/A Off-White is a two-part flame retardant epoxy. Scotch-Weld EC-3524 B/A Off-White can be used for void filling, edge sealing and...
A one part, high temperature curing, void filling compound. This product has the same formula as Scotch-Weld™ 3500–2 B/A, but it is the deaerated one part version. PMF stands for...
A two part, room temperature curing, low density void filling compound. It is designed for reinforcement of honeycomb sandwich constructions typically found in aircraft interior structures, honeycomb joining and bonding...
A two-part, high temperature curing, void filling compound. It is designed for honeycomb sandwich constructions, honeycomb splicing and reinforcement, mismatch areas filling, and inserts bonding. Offers the following advantages: High...
Designed for exterior edge finishing. Combination of toughness and flexibility. Dual curing system (250 F to 350 F). First foaming material with good impact resistance.
Dual-cure 120c or 180c curing, low-density, expandable product for these applications: honeycomb sandwich edge finishing, filling mismatched areas, and core splicing and reinforcing honeycomb core. Fulfills stand-alone fire, smoke and...
Epoxy used for filling voids and honeycomb core. Cures to a rigid, solvent-resistant material in one hour at 250F (121C). The compound has thixotropic properties for ease of application. Cured...
Fast-Drying, Fire Retardant. Apply Over Movable Part. Tampering with Part can be Detected by Break in Sealant.
Structural one-part low weight void filler for aircraft interiors. One-part low weight filler combining extreme low density with high extrusion rate for manual and automatic applications. Pumpable. Full stand alone...
Structural Two Part Extrudable Low Density Void Filler. Two part RT cure low density void filler designed for honeycomb construction of aircraft interiors - available in cartridges.
Structural two part paste adhesive featuring full stand alone FST properties, good fluid resistance and ease of design to flexible substrates of a wide variety.
Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits...