A two-part, high temperature curing, void filling compound. It is designed for honeycomb sandwich constructions, honeycomb splicing and reinforcement, mismatch areas filling, and inserts bonding.
Offers the following advantages: High performance from -55°C to + 175°C, convenient 1:1 mix ratio by weight, thixotropic for ease of application, long work life at 15-25°C, low volatiles loss during cure. Cures from 120°C to 175°C in one hour. Low cured density. Excellent water and chemical resistance. Room temperature storage of the two compounds.
| 3M Aerospace and Aircraft Maintenance Division | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | SW 3500-2 B/A |
| Product Name | 3M™ Scotch-Weld™ Structural Void Filling Compound |
| Cure / Technology | Thermoset; Single Component |
| Type / Form | Grease, Paste |
| Substrate Compatibility | Honeycomb Core |
| Chemical System | Epoxy |
