HORIBA Instruments, Inc. Datasheets for Semiconductor Wet Process Equipment
Semiconductor wet process equipment performs a variety of wet processing applications including etching, washing, chemical mechanical polishing (CMP), and spin coating in semiconductor or microelectronics manufacturing.
Semiconductor Wet Process Equipment: Learn more
| Product Name | Notes |
|---|---|
| High precision and high performance HF concentration monitor enables micro-process management with +/- 2.0 ppm (highest accuracy), high speed sampling & output, 2-channel sensors, and intra-sensor pressure correction function. Suitable... | |
| The CS-100 Series monitors measure in real time the concentrations of various types of chemical solutions and have the capability to control the timing of automatic chemical spiking. Measurement is... | |
| The CS-131 is a high-precision chemical concentration monitor designed for use with SC-1 solutions used in cleaning processes during semiconductor manufacturing. It offers a faster response speed in a more... | |
| The CS-137 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use BHF solution to etch silicon oxide and remove... | |
| The CS-139E is a high-precision chemical concentration monitor designed for use with TMAH/H2O2 solutions used in cleaning processes during semiconductor manufacturing. It offers a faster response speed and a more... | |
| The CS-600F achieves a higher level of functionality best suited for manufacturing, such as the ability to perform in-line measurement of high temperature chemical solutions in various applications, stable operation... | |
| The HORIBA CS-700 chemical concentration monitor enables high performance measurement of the individual chemical constituents of complex chemistries used in the leading edge Semiconductor Manufacturing Processes. By improving HORIBA's renowned... |