HORIBA Instruments, Inc. Datasheets for Semiconductor Wet Process Equipment

Semiconductor wet process equipment performs a variety of wet processing applications including etching, washing, chemical mechanical polishing (CMP), and spin coating in semiconductor or microelectronics manufacturing.
Semiconductor Wet Process Equipment: Learn more

Product Name Notes
High precision and high performance HF concentration monitor enables micro-process management with +/- 2.0 ppm (highest accuracy), high speed sampling & output, 2-channel sensors, and intra-sensor pressure correction function. Suitable...
The CS-100 Series monitors measure in real time the concentrations of various types of chemical solutions and have the capability to control the timing of automatic chemical spiking. Measurement is...
The CS-131 is a high-precision chemical concentration monitor designed for use with SC-1 solutions used in cleaning processes during semiconductor manufacturing. It offers a faster response speed in a more...
The CS-137 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use BHF solution to etch silicon oxide and remove...
The CS-139E is a high-precision chemical concentration monitor designed for use with TMAH/H2O2 solutions used in cleaning processes during semiconductor manufacturing. It offers a faster response speed and a more...
The CS-600F achieves a higher level of functionality best suited for manufacturing, such as the ability to perform in-line measurement of high temperature chemical solutions in various applications, stable operation...
The HORIBA CS-700 chemical concentration monitor enables high performance measurement of the individual chemical constituents of complex chemistries used in the leading edge Semiconductor Manufacturing Processes. By improving HORIBA's renowned...