Technic, Inc. Wet Bench SEMCON 1000

Description
Low cost wet bench design for R&D and low volume applications. Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series. Tool features a single plating cell and dragout rinse cell. Plating and electroforming of wafers or discrete parts, slivers, etc., up to 200mm. Tool is self-contained, constructed of white polypropylene with a clear PVC process cover designed to meet class 1000 clean room specification. Plating cell components include heating temperature control, low level safety device, pump and filter, DC power supply, and wafer holder.
  • Wet Bench - SEMCON 1000 - Technic, Inc.
    Technic, Inc.
Description
Low cost wet bench design for R&D and low volume applications. Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series. Tool features a single plating cell and dragout rinse cell. Plating and electroforming of wafers or discrete parts, slivers, etc., up to 200mm. Tool is self-contained, constructed of white polypropylene with a clear PVC process cover designed to meet class 1000 clean room specification. Plating cell components include heating temperature control, low level safety device, pump and filter, DC power supply, and wafer holder.

Suppliers

Company
Product
Description
Supplier Links
Wet Bench - SEMCON 1000 - Technic, Inc.
Technic, Inc.
Cranston, RI, USA
Wet Bench
SEMCON 1000
Wet Bench SEMCON 1000
Low cost wet bench design for R&D and low volume applications. Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series. Tool features a single plating cell and dragout rinse cell. Plating and electroforming of wafers or discrete parts, slivers, etc., up to 200mm. Tool is self-contained, constructed of white polypropylene with a clear PVC process cover designed to meet class 1000 clean room specification. Plating cell components include heating temperature control, low level safety device, pump and filter, DC power supply, and wafer holder.
  • Low cost wet bench design for R&D and low volume applications.
  • Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series.
  • Tool features a single plating cell and dragout rinse cell.
  • Plating and electroforming of wafers or discrete parts, slivers, etc., up to 200mm.
  • Tool is self-contained, constructed of white polypropylene with a clear PVC process cover designed to meet class 1000 clean room specification.
  • Plating cell components include heating temperature control, low level safety device, pump and filter, DC power supply, and wafer holder.
Supplier's Site

Technical Specifications

  Technic, Inc.
Product Category Thin Film Equipment
Product Number SEMCON 1000
Product Name Wet Bench
Applications LEDs, Solder Bump Pads, Solder Bumps, MOEMS
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