Technic, Inc. Automatic Wet Bench SEMCON 4000

System Overview The SEMCON 4000 is an automatic loading and unloading “wet bench” type wafer Under Bump Metalization tool, designed with processes for Nickel and Gold metalization of silicon and Ga/As wafers with aluminum or copper seed layer. The Semcon 4000 tool is designed with multiple processes, which handle a single cassette of (25) wafers at a time up to 200mm diameter. The tool handles cassettes “dry in” and “dry out”. The wafer cassettes are manually presented and removed to the tool loading / unloading port. Each cassette is loaded into a sliding drawer mechanism to provide a precise location for the automatic hoist to pick up. The hoist picks up a cassette and automatically conveys the cassette through each of the wet processing steps via a servomotor cable driven, X and Z-axis hoist. When the cassette is finished all processes the hoist returns the cassette to the unloading port located at the same end of the tool as the loading port. The unloading port also has a sliding drawer mechanism to allow easy unloading of the cassette from the tool. The tool may be configured with darkened outside inspection panels for light sensitive junction applications. Configuration Tools are configured with Electroless Nickel metialization tools after 6-8 hours of operation the cell will have to be emptied and stripped to remove trace metallization deposited on processes cell and components. Tools can be supplied with various configurations of manual and automatic stripping systems The tool is a multi section modular chassis design that is totally enclosed, and is designed to meet class 100 clean room specifications. The process cell / tank assemblies are removable for maintenance purposes. The chassis is constructed from white polypropylene and features an integral exhaust plenum, leveling feet and clear or darkened front inspection doors. The process sections of the tool are equipped with bottom containment, which is located directly underneath the processing area. Containment area will hold 125% of all process cell volumes. Plating cells and associated components, and plumbing are constructed from natural PVDF. Each process cell is equipped with an automatic opening cover assembly to provide a controlled processing environment. The tool is configured with all necessary hardware including, servomotor driven hoist / cassette transfer mechanism, travel limit sensors, heaters, temperature controllers, low level safety devices, process pumps, filter housing, wafer cassette agitation mechanisms, wafer carrier racks, and quick dump rinse cell assemblies, and cassette drying cell for processing substrates. Safety As an option, for maximum tool fire prevention properties, the tool’s modular chassis may be constructed from CP7-D polypropylene to meet FM-4910 material specifications. Summary of Standard Features Chassis Design The Semcon 4000 is designed with multiple integrated module units containing all necessary components & removable process cells. Expandability Modular chassis construction allows placing additional units side by side for future expansion. Easy Subassembly Maintenance Pumps, heat exchangers, and supporting components are designed for easy maintenance access. Substrate Size Flexibility Process cells can accommodate a variety of cassette sizes and geometries up to 200mm in diameter. Process & Metalization Cell Production All process cells are configured to accommodate one wafer cassette with (25) wafers per process. Vertical Substrate Agitation The vertical agitation mechanism eliminates the formation of gas bubbles on the surface of the wafers during metallization processes. The vertical stroke is a variable speed motor controlled cam operated lift for smooth agitation to eliminate stress on fragile wafers. Stroke per minute cycles are programmable. Solution Flow Control Process pump motors are equipped with a closed loop electronic flow control system using an in-line flow sensor coupled to a VFD pump motor controller. This provides a programmable, constant cell flow value & minimizes air entrapment. Process Cell Drain Control Drains are equipped with pneumatically activated valves operated from the HMI touch panel. Semi Automatic Stripping Process Provision for on-line or off-line stripping of electroless nickel metallization process cell. Includes all necessary components including a remote electroless nickel solution holding tank, nitric acid holding tank, transfer pump with valving, flexible piping and self closing quick disconnect fittings and stripping process timer. Automatic Electroless Nickel Controller Nickel concentration monitoring and metering pump unit used to automatically add electroless nickel makeup component as required. Optional pH control. Process Cell Covers Process cells are equipped with automatic opening cover assembly providing a controlled processing environment. Auxiliary DI Water & N2 Spray Guns Spray guns are conveniently mounted in process chassis module for cleaning tool deck surfaces. Automation System & Touch Screen Controls The Semcon 4000 is equipped with PC based automation system, I/O devices configured for all discrete & analog control functions, and feature a color graphical interface via touch screen HMI. Remote Troubleshooting Provisions for remote troubleshooting & program maintenance via dedicated phone line and 56 Kbps modem are provided. Component Identification All valves, filters, and drain components will be labeled per their appropriate process. Cassette Processing End Effector The transfer hoist is equipped with a dedicated dimension end effector to handle customer specified cassette size. Flare Type Plumbing Fittings Used for all process, DI water supplies, and bleed lines where possible. Tool Installation Standard installation of the Semcon 4000 is included at no extra cost.