Protavic America, Inc. Datasheets for Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more
| Product Name | Notes |
|---|---|
| Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm°K thermal performance with supporting laser flash data. Room temperature cure. | |
| Filled one-part system with 30 days of storage at room temperature. Electronics grade, offers excellent bond strength while dissipating heat up to 1Wm°K. Often used as a die & | |
| Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing. | |
| Silver filled epoxy system for coating tantalum capacitor slugs. This product offers ideal protection from moisture and excellent high temperature operation. Consistent operation of 175C is typical. The product is... | |
| Silver filled epoxy system for tantalum & ceramic termination coating. This product is commonly used for flexible termination of capacitors and offers high strength and flexibility. This product is the... | |
| Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast... | |
| Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachsuch as RFID isotropic applications and can be dispensed, printed... | |
| Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for... | |
| A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is... | |
| A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. | |
| A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about... | |
| Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. | |
| PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid... | |
| PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ | |
| PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance... | |
| PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are... | |
| PVIC ACE24511 electrically conductive die attach adhesive is specially designed for tantalum condenser application. This single component, fast cure adhesive also can be snap cured in hot plate or in-line... | |
| PVIC ACE34030 electrically conductive die attach adhesive is designed for high reliability semiconductor or LED packaging application. This high purity adhesive has been engineered for use in high throughput in-line... | |
| PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach... | |
| Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA. | |
| Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic... | |
| The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids... | |
| The PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B is a two-component system, solvent free, electrically insulating epoxy adhesive, which is specially designed for protecting the devices from heat, humidity and... |