Protavic America, Inc. Datasheets for Electrical Insulation and Dielectric Materials

Electrical insulation and dielectric materials includes various forms of materials that surround and protect electrical conductors and prevent unwanted current flow, leakage or crosstalk.
Electrical Insulation and Dielectric Materials: Learn more

Product Name Notes
Epoxy Adhesive -- ANE-46505 Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available...
Room Temp Curing Epoxy Adhesive -- ATE-46446 Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm°K thermal performance with supporting laser flash data. Room temperature cure.
Epoxy Adhesive -- ANE-47927 Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures.
Epoxy Adhesive -- ANE-47932 Filled epoxy system. Very high performance material designed for difficult bonding applications. This material will bond to stencil foil without holes and can withstand high heat and harsh chemical environments.
Thermo-Conducting Epoxy Adhesive -- ATE-10120 Filled one-part system with 30 days of storage at room temperature. Electronics grade, offers excellent bond strength while dissipating heat up to 1Wm°K. Often used as a die &
Non-Conductive Insulating Epoxy Resin -- ANE-10932 Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
Filled Epoxy Cast -- PNE-30270 A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.
Filled Epoxy Cast -- PNE-30273 A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about...
Epoxy Adhesive -- ANE-46515 Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and...
High Speed Epoxy Adhesive -- ANE-57103 ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals...
Epoxy Adhesive -- ANE-26144 Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist...
Heat Cure Epoxy Adhesive -- ANE-17794 Clear unfilled epoxy in a one-part system that can be stored at room temperature for up to 6 months. This material is excellent for ferrite and ceramic bonding applications. Non-hazardous...
Fast Flow, Fast Cure Epoxy Adhesive -- ANE-10931 Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used...
Epoxy Adhesive -- ANE-20904 Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.
Reworkable Underfill Epoxy Resin -- ANA-10199R Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap...
Epoxy Potting/Sealant -- PNE-47207 PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and...
Urethane Adhesive/Encapsulant -- PNU-46220 PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread...
Urethane Cast Adhesive -- PNU-46202 PNU-46202™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing.
Urethane Cast/Adhesive -- PNU-46203 PNU-46203™ is an electronics grade, two-component polyurethane adhesive or encapsulant for high temperature resistance. PNU-46203™ is designed for the encapsulation by casting of completed circuit boards. Cured PNU-46203™ is expected...
Polyurethane Adhesive -- PNU-56200 PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing.
Epoxy Cast -- PTE-36977 PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™
Silicone Encapsulant -- PTS-46303 PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance...
Silicone Encapsulant -- PTS-46313 PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are...
Silicone Encapsulant -- PTS-46323 PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity,...
Filled Epoxy Cast -- PNE-20262 Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA.
Non Conductive Epoxy Adhesive -- ANE-10700 Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic...
Filled Epoxy Cast Adhesive -- PNE-40824-A
Filled Epoxy Cast Adhesive -- PNE-40824-B
The PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B is a two-component system, solvent free, electrically insulating epoxy adhesive, which is specially designed for protecting the devices from heat, humidity and...
Clear Urethane Cast/Adhesive -- PNU-46201 The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of...
Filled Urethane Cast/Adhesive -- PTU-46201 The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit boards. When applied in thin layers, < 0.01� it...