Palomar Technologies, Inc Datasheets for Die Bonders

Die bonders permanently attach a semiconductor die or chip to a package or substrate.


Die Bonders: Learn more

Product Name Notes
Overview Developed for the demanding needs of the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron high precision placement accuracy and speeds up...
Overview Palomar Technologies' 3880 Die Bonder component placement die attach system features a state of the art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest and most reliable...
Overview The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless, and medical...
Overview The Palomar 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Its...
Overview The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder with optional interchangeable clamps for 45-60° and 90° deep access bonding on a single machine.
Overview The SST 8301 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure.
Overview The SST 8303 is a single chamber, automated vacuum pressure soldering system designed to deliver a reliable low-void, flux-less solder process using precise combination of vacuum and gas pressure.