Palomar Technologies, Inc Die Bonder Palomar 6532HP

Description
Overview Developed for the demanding needs of the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron high precision placement accuracy and speeds up to 1200 UPH means maximum throughput for you and your customers. Automated presentation of dual 8” wafers, or up to 72 wafflepacks, or tape dispensers provides a high production, flexible parts presentation platform. The 6 position, bi-directional tool turret allows “on-the-fly” tool changes to maximize speed and flexibility. A variety of options and variations adds flexibility to the 6532HP and allow you to package the widest range of optoelectronic devices on a single system. Adding VisionPilot® with Radar Referencing® ensures accurate parts identification, location and placement, thus reducing raw material cost and eliminating fixturing requirements. Steady state or pulse heat stages, dispensing capability, daub pot epoxy dispense, look up cameras and remote machine control software are all available to help configure your system. Applications High capacity magazine handler Fluid dispensers Epoxy daub/stamp tools Air bearing table Steady state or pulse heat stages Flip chip (90°-180°) Features Double-pick process protected under US Patent 6,776,327
Description
Overview Developed for the demanding needs of the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron high precision placement accuracy and speeds up to 1200 UPH means maximum throughput for you and your customers. Automated presentation of dual 8” wafers, or up to 72 wafflepacks, or tape dispensers provides a high production, flexible parts presentation platform. The 6 position, bi-directional tool turret allows “on-the-fly” tool changes to maximize speed and flexibility. A variety of options and variations adds flexibility to the 6532HP and allow you to package the widest range of optoelectronic devices on a single system. Adding VisionPilot® with Radar Referencing® ensures accurate parts identification, location and placement, thus reducing raw material cost and eliminating fixturing requirements. Steady state or pulse heat stages, dispensing capability, daub pot epoxy dispense, look up cameras and remote machine control software are all available to help configure your system. Applications High capacity magazine handler Fluid dispensers Epoxy daub/stamp tools Air bearing table Steady state or pulse heat stages Flip chip (90°-180°) Features Double-pick process protected under US Patent 6,776,327

Suppliers

Company
Product
Description
Supplier Links
Die Bonder - Palomar 6532HP - Palomar Technologies, Inc
Carlsbad, CA, United States
Die Bonder
Palomar 6532HP
Die Bonder Palomar 6532HP
Overview Developed for the demanding needs of the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron high precision placement accuracy and speeds up to 1200 UPH means maximum throughput for you and your customers. Automated presentation of dual 8” wafers, or up to 72 wafflepacks, or tape dispensers provides a high production, flexible parts presentation platform. The 6 position, bi-directional tool turret allows “on-the-fly” tool changes to maximize speed and flexibility. A variety of options and variations adds flexibility to the 6532HP and allow you to package the widest range of optoelectronic devices on a single system. Adding VisionPilot® with Radar Referencing® ensures accurate parts identification, location and placement, thus reducing raw material cost and eliminating fixturing requirements. Steady state or pulse heat stages, dispensing capability, daub pot epoxy dispense, look up cameras and remote machine control software are all available to help configure your system. Applications High capacity magazine handler Fluid dispensers Epoxy daub/stamp tools Air bearing table Steady state or pulse heat stages Flip chip (90°-180°) Features Double-pick process protected under US Patent 6,776,327

Overview

Developed for the demanding needs of the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron high precision placement accuracy and speeds up to 1200 UPH means maximum throughput for you and your customers. Automated presentation of dual 8” wafers, or up to 72 wafflepacks, or tape dispensers provides a high production, flexible parts presentation platform. The 6 position, bi-directional tool turret allows “on-the-fly” tool changes to maximize speed and flexibility.

A variety of options and variations adds flexibility to the 6532HP and allow you to package the widest range of optoelectronic devices on a single system. Adding VisionPilot® with Radar Referencing® ensures accurate parts identification, location and placement, thus reducing raw material cost and eliminating fixturing requirements.

  • Steady state or pulse heat stages, dispensing capability, daub pot epoxy dispense, look up cameras and remote machine control software are all available to help configure your system.

Applications

  • High capacity magazine handler
  • Fluid dispensers
  • Epoxy daub/stamp tools
  • Air bearing table
  • Steady state or pulse heat stages
  • Flip chip (90°-180°)

Features

  • Double-pick process protected under US Patent 6,776,327
Supplier's Site

Technical Specifications

  Palomar Technologies, Inc
Product Category Die Bonders
Product Number Palomar 6532HP
Product Name Die Bonder
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