Overview
The Palomar 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Its patented Dual Z-Axis bond head enables very reliable Deep Access wire bond performance. This machine is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs, and high-reliability devices.
Intelligent Interactive Graphical Interface® (i2Gi®) offers the required management for modern wire bonding, from part design and development to process validation and intuitive operations control.
i2Gi is implemented on the 8000i Wire Bonder and available as a Bonder Performance Upgrade (BPU) for 8000 Wire Bonders.
The planarBump™ feature, a patented technology that uses gold wire to produce tailless ball bumps, makes the 8000i Wire Bonder suitable for flip chip and other advanced packaging applications. The overall precision of the 8000i Wire Bonder, along with its large work area and its available deep access capability, results in high-yield processing of fine pitch/high wire count applications.
A ball bumper and stud bumper configuration of the 8000i Wire Bonder is a unique feature of this system. The 8000i Wire Bonder is the only available system that can produce co-planarized gold bumps in one step.
Ball Bumping Applications
MEMS
Sensors
Stacked memory devices internal components, such as DSPs, ASICs, SAW filters, high bright/high power LEDs, and CMOS image sensors
Common Applications
Automotive assemblies
Chip on board (COB)
CMOS camera modules
Disk drive assemblies
Display and solar panels
Fine pitch devices
Flex circuits
Large complex hybrids
Multichip modules (MCMs)
Specialty lead frames
System in packages (SIPs)
Overview
The Palomar 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Its patented Dual Z-Axis bond head enables very reliable Deep Access wire bond performance. This machine is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs, and high-reliability devices.
Intelligent Interactive Graphical Interface® (i2Gi®) offers the required management for modern wire bonding, from part design and development to process validation and intuitive operations control.
i2Gi is implemented on the 8000i Wire Bonder and available as a Bonder Performance Upgrade (BPU) for 8000 Wire Bonders.
The planarBump™ feature, a patented technology that uses gold wire to produce tailless ball bumps, makes the 8000i Wire Bonder suitable for flip chip and other advanced packaging applications. The overall precision of the 8000i Wire Bonder, along with its large work area and its available deep access capability, results in high-yield processing of fine pitch/high wire count applications.
A ball bumper and stud bumper configuration of the 8000i Wire Bonder is a unique feature of this system. The 8000i Wire Bonder is the only available system that can produce co-planarized gold bumps in one step.
Ball Bumping Applications
- MEMS
- Sensors
- Stacked memory devices internal components, such as DSPs, ASICs, SAW filters, high bright/high power LEDs, and CMOS image sensors
-
Common Applications
- Automotive assemblies
- Chip on board (COB)
- CMOS camera modules
- Disk drive assemblies
- Display and solar panels
- Fine pitch devices
- Flex circuits
- Large complex hybrids
- Multichip modules (MCMs)
- Specialty lead frames
- System in packages (SIPs)
