Accuris Datasheets for Standards and Technical Documents
Standards and technical documents includes standards, codes, regulation, handbooks, manuals, comprehensive guides and other formal publications. Standards, codes, and regulation establish uniform specifications, procedures or technical criteria.
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| Product Name | Notes |
|---|---|
| (R) Configuration Management Acquisition Requirements for Aeronautics and Space | |
| (R) Configuration Management Requirements for Defense Contracts | |
| (R) Configuration Management Standard | |
| (R) Requirements for a COTS Assembly Management Plan | |
| (R) Requirements for an Electronic Components Management Plan | |
| 4 mm Embossed Carrier Taping of Micro-Sized Surface Mount Components for Automatic Handling | |
| 72 mm Through 200 mm Carrier Tapes for Packaging Components for Automatic Handling | |
| A DTV Profile for Uncompressed High Speed Digital Interfaces | |
| Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick | |
| Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0mm Thick | |
| Adhesively-Sealed Component Packaging | |
| Aluminum Electrolytic Chip Capacitor with Polmer Cathode | |
| ALUMINUM-ELECTROLYTI C CAPACITOR APPLICATION GUIDELINE | |
| Analog 525 Line Component Video Interface - Three Channels | |
| Application Guide for Multilayer Ceramic Capacitors - Electrical | |
| Arc Flash Implementation Guideline | |
| ASSEMBLY COMPONENT TRAY - ACT | |
| Assembly Component Tray \x96 ACT | |
| Assessment Guide for Process Certification | |
| Assessment of Average Outgoing Quality Levels in Parts Per Million (PPM) | |
| Assessment of Nonconforming Levels In Parts Per Million (PPM) | |
| Assessment of Quality Levels in PPM Using Variables Test Data | |
| Asynchronous Facsimile DCE Control Standard - Service Class I | |
| Automation Bulletin No. 3 | |
| Blank Detail Specification Connector Set for Optical Fibers and Cables Type FSMA: Environmental Category I | |
| Blank Detail Specification Connector Set for Optical Fibers and Cables Type FSMA: Environmental Category II | |
| Blank Detail Specification Connector Set for Optical Fibers and Cables Type FSMA: Environmental Category III | |
| Blank Detail Specification for Adaptor - Carrier Quad Flat Pack to Pin Grid Array Sockets for Use in Electronic Equipment | |
| Blank Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment | |
| Blank Detail Specification for Class IVb Dispersion - Shifted Single - Mode Optical Waveguide Fibers | |
| Blank Detail Specification for Dual In-Line Sockets for Use in Electronic Equipment | |
| Blank Detail Specification for Fiber Optic Communications Cable for Indoor Use - All-Dielectric (Construction 1) | |
| Blank Detail Specification for Fiber Optic Communications Cable for Indoor Use - Optical Fiber and Electrical Conductors (Construction 3) | |
| Blank Detail Specification for Fiber Optic Communications Cable for Indoor Use - Optical with Metallic Elements (Construction 2) ] | |
| Blank Detail Specification for Fiber Optic Communications Cable for Outside Plant Use - All-Dielectric | |
| Blank Detail Specification for Field Portable Optical Microscopes for Inspection of Optical Waveguides and Related Devices | |
| Blank Detail Specification for Nonpressurized Fiber Optic Splice Closures | |
| Blank Detail Specification on Relay Sockets | |
| Cabinets, Racks, Panels, and Associated Equipment | |
| Cable Compatibility Requirements for Two-Way Digital Cable TV Systems | |
| Cable Compatibility Requirements | |
| Cable Television Channel Identification Plan | |
| Carriage of DTV PSIP Information Using the XDS Method | |
| CDIF - CASE Data Interchange Format - Overview | |
| CDIF - Framework for Modeling and Extensibility | |
| CDIF - Integrated Meta-model Foundation Subject Area | |
| CDIF - Transfer Format Encoding - ENCODING.1 | |
| CDIF - Transfer Format General Rules for Syntaxes and Encodings | |
| CDIF - Transfer Format Syntax - SYNTAX.1 | |
| CDIF Integrated Meta-model - State/Event Model Subject Area | |
| CDIF Integrated Meta-model Common Subject Area | |
| CDIF Integrated Meta-model Data Flow Model Subject Area | |
| CDIF Integrated Meta-model Data Modeling Subject Area | |
| CDIF Integrated Meta-model Presentation Location and Connectivity Subject Area | |
| Cellular Radio-Telecommunicat ions Intersystem Operations: Automatic Roaming | |
| Cellular Radio-Telecommunicat ions Intersystem Operations: Data Communications | |
| Cellular Radio-Telecommunicat ions Intersystem Operations: Functional Overview | |
| Cellular Radio-Telecommunicat ions Intersystem Operations: Intersystem Handoff | |
| Cellular Radio-Telecommunicat ions Intersystem Operations: Operations, Administration, And Maintenance | |
| Cellular Radiotelecommunicati ons Intersystem Operations: \xb7 Intersystem Handoff | |
| Cellular Radiotelecommunicati ons Intersystem Operations: Automatic Roaming | |
| Cellular Radiotelecommunicati ons Intersystem Operations: Data Communications | |
| Cellular Radiotelecommunicati ons Intersystem Operations: Functional Overview | |
| Cellular Radiotelecommunicati ons Intersystem Operations: Intersystem Handoff | |
| Cellular Radiotelecommunicati ons Intersystem Operations: Operations, Administration, and Maintenance | |
| Cellular System Dual-Mode Mobile Station - Base Station Compatibility Standard | |
| Cellular System Mobile Station - Land Station Compatibility Specification | |
| Check List for Document Development and Revision | |
| Classification of Passive and Solid State Devices for Assembly Processes | |
| Component Tray for Automated Handling | |
| Configuration Management Data Exchange and Interoperability | |
| Configuration Management Requirements For Defense Contracts | |
| Configuration Management Requirements for NASA Enterprises | |
| Configuration Management Standard | |
| Contact Termination Finish Standard for Surface Mount Devices | |
| Control Network Power Line (PL) Channel Specification | |
| Control of Communicable Diseases Manual | |
| Copy Generation Management System (Analog) | |
| Current Occupational & Environmental Medicine | |
| Data Sheet for Electrical Design Criteria | |
| Data Sheet for Electrical Design | |
| Data Sheets for Electrical Design Criteria | |
| Detail Specification Flexible Carrier 2 Piece Dual In-Line Socket for Use in Electronic Equipment | |
| Detail Specification for 1.0 mm, Two-Part Connectors for Use with Parallel Printed Boards | |
| Detail Specification for 1.00 mm Pitch, 88 Circuit Dram Memory Card Interconnect System | |
| Detail Specification for 1.27 mm, Pitch, Ribbon Contact, Trapezoidal Shaped, Shielded I/O Connector | |
| Detail Specification for 2 Millimeter, Two-Part Connectors for Use with Printed Boards and Backplanes | |
| Detail Specification for 2 Pole, 10 A Relay Sockets | |
| Detail Specification for 2 Pole, 5 A Relay Sockets | |
| Detail Specification for 3 Pole, 10 A Relay Sockets | |
| Detail Specification for 62.5-Micrometer Core Diameter/125-Microme ter Cladding Diameter Class la Multimode, Graded Index Optical Waveguide Fibers | |
| Detail Specification for Adaptor \x96 Carrier Quad Flatpack to Pin Grid Array Sockets for Use in Electronic Equipment | |
| Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment | |
| Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment | |
| Detail Specification for Chip Carrier (PCC) Family 1.27 mm (.050 Inch) Leadspacing | |
| Detail Specification for Chip Carrier Sockets for Leadless Type A (1.27 mm (.050") Spacing) Chip Carriers for Use in Electronic Equipment | |
| Detail Specification for Chip Carrier Sockets for Plastic Quad Flat Pack 0.635 mm (.025") Lead Spacing (Gullwing) | |
| Detail Specification for Coin Cell Battery Holders for Use in Electronic Equipment | |
| Detail Specification for Cylindrical Battery Holders, Standard Profile, for Use in Electronic Equipment | |
| Detail Specification for Decoupling Capacitor Dual In-Line Package Sockets for Use in Electronic Equipment | |
| Detail Specification for Dual In-Line Two-Piece Contact Socket for Use in Electronic Equipment | |
| Detail Specification for Low ESR Molded Tantalum Chip | |
| Detail Specification for Mechanically Actuated (Zero and Low Insertion Force) Sockets for Pin Grid Array Devices with 2.54 mm X 2.54 mm (0.1 in X 0.1 in) Spacing for Use... | |
| Detail Specification for Multi- Package 100 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment | |
| Detail Specification for Multi- Package 100 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment | |
| Detail Specification for Multi- Package 50 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment | |
| Detail Specification for Multi- Package 50 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment | |
| Detail Specification for Non-Mechanically Actuated Sockets for Pin Grid Array Devices with 2.54 mm X 2.54 mm (0.1" X 0.1") Spacing for Use in Electronic Equipment | |
| Detail Specification for Production Ball Grid Array (BGA) High Pin Count (1089 Pins and Greater) Socket for Use in Electronic Equipment | |
| Detail Specification for Production Land Grid Array (LGA) Socket for Use in Electronic Equipment | |
| Detail Specification for Round Style Sockets | |
| Detail Specification for Shielded Rectangular Connectors for Universal Serial Bus Plus Power Connectors Series \x93A\x94 | |
| Detail Specification for Shielded Rectangular Connectors for Universal Serial Bus Plus Power Connectors Series \x93B\x94 | |
| Detail Specification for the Interface of the 1.27 mm Pitch, Ribbon Contact (Leaf Spring), Trapezoidal Shaped, Self-Locking I/O Connector | |
| Detail Specification for Trapezoidal Connectors with Nonremovable Ribbon Cable Contacts on 1.27 mm Pitch Double Row Used with Single Connector Attachments (SCA2) | |
| Detail Specification for Trapezoidal Shielded Connector 0.8 mm Pitch Used with Very High Density Cable Interconnect (VHDCI) | |
| Detail Specification Nonmechanically Actuated Flexible Carrier Sockets for Pin Grid Array for Use in Electronic Equipment | |
| Detail Specification on Relay Socket - 10 A for Balanced Armature Relay | |
| Detail Specification on Relay Sockets - 5 A for Balanced Armature Relay | |
| Device Plug-In Interface to EIA-709.1 Network Tools | |
| DTV Profile for Uncompressed High Speed Digital Interfaces | |
| DTV Remodulator Specification | |
| Earned Value Management Systems | |
| ECA Component Registration Integrated Passive Devices Product Registrations | |
| EDIF Connectivity Monograph Series | |
| EIA Specification for Small Form Factor 63.5 mm (2.5 in) Disk Drives | |
| EIA Standards for Electron Tubes | |
| ElasticSearch Cookbook | |
| ElasticSearch Server | |
| Electric Lamps - 35-Watt, 52-Volt S76 High-Pressure Sodium Lamps - Specifications; Supplement C78.1358A - 1990 (Consolidated to ANSI/NEMA C78.42-1995) | |
| Electric Motor Voltage Dip Impact Mitigation | |
| Electric Vehicle Charging Station Implementation Criteria | |
| ELECTRICAL APPARATUS FOR EXPLOSIVE GAS ATMOSPHERES - PART 10: CLASSIFICATION OF HAZARDOUS AREAS ***SAME AS BS EN 60079-10 * SEE ALSO IEC 60079 SET*** | |
| Electrical Design Criteria | |
| Electrical Equipment Obsolescence Evaluation Guideline | |
| Electrical Installation Calculations: For compliance with BS 7671: 2001 (The Wiring Regulations) 3rd Edition | |
| ELECTRICAL INSTALLATION REQUIREMENTS A Global Perspective | |
| Electrical Interface between Numerical Control and Machine Tools | |
| Electrical Manhole / Cable Vault Design Criteria | |
| Electrical Performance for Television Transmission Systems | |
| Electrical Power System Event Reporting Guideline | |
| Electrical Product Acceptance in Europe: Nema Guide to Europe's New Approach Directives and CE Marking | |
| Electrical Safety Handbook, Fourth Edition | |
| Electromagnetic Compatibility (EMC) Part 2: Environment Section 2: Compatibility Levels for Low-Frequency Conducted Disturbances and Signalling in Public Low-Voltage Power Supply Systems; (CENELEC ENV 61000-2-2: 1993) | |
| Electromagnetic Compatibility (EMC) Part 4: Testing and Measurement Techniques Section 1: Overview of Immunity Tests Basic EMC Publication; (Corrigendum-1995) (CENELEC EN 61000-4-1: 1994) | |
| Electronic Book- QMS v2.0 (CD ROM) | |
| Electronic Data Entry Sheet for Electrical Equipment Obsolescence Evaluation Guideline | |
| Electronic Design Interchange Format Version 200 | |
| Electronic Entry Data Sheet for Electrical Power System Event Reporting | |
| Electronic Entry Data Sheet for Microgrid Design Criteria | |
| Electronic Entry Data Sheets for Electric Vehicle Charging Station | |
| Electronic Entry Data Sheets for Electrical Area Classification | |
| Electronic Entry Data Sheets for Electrical Design | |
| Electronic Entry Data Sheets for Engineering Guide for Determining Electrical Area Classification | |
| Electronic Entry Data Sheets for Grounding and Bonding | |
| ELECTRONIC MATERIALS HANDBOOK V1: PACKAGING | |
| ELECTROPLATING, BRIGHT OR LOW GLOSS DECORATIVE FINISH WSS-M1P83-D2 OVER ABS \x96 EXTERIOR, LOW TEMPERATURE APPLICATIONS ***TO BE USED WITH FORD WSS-M99P1111-A*** | |
| Engineering & Operations Council Guide for Committee Review of Government Documents | |
| Engineering & Operations Council Organization and Operation Manual | |
| Engineering Guide for Determining Electrical Area Classification | |
| ERRATA TO EIA/IS-32 Assessment of Quality Levels in PPM Using Variables Test Data | |
| Essentials of ICT Bonding and Grounding | |
| Facsimile Coding Schemes and Coding Control Functions for Group 4 Facsimile Equipment | |
| Fault Tree Analysis | |
| Fixed Capacitors for Use in Electronic Equipment - Part 11: Sectional Specification \x96 Fixed Polyethylene-Terepht halate Film Dielectric Metal Foil DC Capacitors | |
| Fixed Capacitors for Use in Electronic Equipment - Part 16: Sectional Specification - Fixed Metallized Polyethylene Film Dielectric d.c. Capacitors | |
| Fixed Capacitors for Use in Electronic Equipment - Part 17: Sectional Specification - Fixed Metallized Polyethylene Film Dielectric a.c. and Pulse Capacitors | |
| Fixed Capacitors for Use in Electronic Equipment - Part 1: Generic Specification | |
| Fixed Capacitors for Use in Electronic Equipment - Part 24: Sectional Specification - Fixed Tantalum Electrolytic Surface Mount Capacitors with Conductive Polymer Solid Electrolyte | |
| Fixed Capacitors for Use in Electronic Equipment - Part 25: Sectional Specification: Fixed Aluminium Electrolytic Surface Mount Capacitors with Conductive Polymer Solid Electrolyte | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 11: Sectional Specification \x96 Fixed Polyethylene-Terepht halate Film Dielectric Metal Foil d.c. Capacitors | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 13: Sectional Specification \x96 Fixed Polypropylene Film Dielectric Metal Foil d.c. Capacitors | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 15: Sectional Specification \x96 Fixed Tantalum Capacitors with Non-Solid or Solid Electrolyte | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 16: Sectional Specification \x96 Fixed Metallized Polypropylene Film Dielectric d.c. Capacitors | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 17: Sectional Specification \x96 Fixed Metallized Polypropylene Film Dielectric a.c. and Pulse Capacitors | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 18: Sectional Specification \x96 Fixed Aluminium Electrolytic Surface Mount Capacitors with Solid (MnO2) and Non-Solid Electrolyte | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 19: Sectional Specification \x96 Fixed Metallized Polyphenylene- Terephthalate Film Dielectric Surface Mount d.c. Capacitors | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 1: Generic Specification | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 20: Sectional Specification \x96 Fixed Metallized Polyphenylene Sulfide Film Dielectric Surface Mount d.c. Capacitors | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 21: Sectional Specification \x96 Fixed Surface Mount Multilayer Capacitors of Ceramic Dielectric, Class 1 | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 22: Sectional Specification \x96 Fixed Surface Mount Multilayer Capacitors of Ceramic Dielectric, Class 2 | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 23: Sectional Specification \x96 Fixed Surface Mount Metallized Polyethylene Naphthalate Film Dielectric DC Capacitors | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 24: Sectional Specification \x96 Surface Mount Fixed Tantalum Electrolytic Capacitors with Conductive Polymer Solid Electrolyte | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 25-1: Blank Detail Specification \x96 Surface Mount Fixed Aluminium Electrolytic Capacitors with Conductive Polymer Solid Electrolyte \x96 Assessment Level EZ | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 25: Sectional Specification \x96 Surface Mount Fixed Aluminium Electrolytic Capacitors with Conductive Polymer Solid Electrolyte | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 26-1: Blank Detail Specification \x96 Fixed Aluminium Electrolytic Capacitors with Conductive Polymer Solid Electrolyte \x96 Assessment Level EZ | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 26: Sectional Specification \x96 Fixed Aluminium Electrolytic Capacitors with Conductive Polymer Solid Electrolyte | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 2: Sectional Specification \x96 Fixed Metallized Polyethylene Terephthalate Film Dielectric d.c. Capacitors | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 3: Sectional Specification \x96 Surface Mount Fixed Tantalum Electrolytic Capacitors with Manganese Dioxide Solid Electrolyte | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 4: Sectional Specification \x96 Aluminium Electrolytic Capacitors with Solid (MnO2) and Non-Solid Electrolyte | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 8: Sectional Specification \x96 Fixed Capacitors of Ceramic Dielectric, Class 1 | |
| Fixed Capacitors for Use in Electronic Equipment \x96 Part 9: Sectional Specification \x96 Fixed Capacitors of Ceramic Dielectric, Class 2 | |
| Fixed Electric Double-Layer Capacitors for Use in Electronic Equipment \x96 Part 1: Generic Specification | |
| Fixed Electric Double-Layer Capacitors for Use in Electronic Equipment \x96 Part 2-1: Blank Detail Specification \x96 Electric Double- Layer Capacitors for Power Application \x96 Assessment Level EZ | |
| Fixed Electric Double-Layer Capacitors for Use in Electronic Equipment \x96 Part 2: Sectional Specification \x96 Electric Double- Layer Capacitors for Power Application | |
| Fixed Inductors for Electromagnetic Interference Suppression - Part 1: Generic Specification | |
| Fixed Inductors for Electromagnetic Interference Suppression - Part 2: Sectional Specification | |
| Fixed Inductors for Electromagnetic Interference Suppression \x96 Part 1: Generic Specification | |
| Fixed Inductors for Electromagnetic Interference Suppression \x96 Part 2-1: Blank Detail Specification \x96 Inductors for Which Safety Tests Are Required \x96 Assessment Level D | |
| Fixed Inductors for Electromagnetic Interference Suppression \x96 Part 2-2: Blank Detail Specification \x96 Inductors for Which Safety Tests Are Required (Only) | |
| Fixed Inductors for Electromagnetic Interference Suppression \x96 Part 2: Sectional Specification | |
| Fixed Resistors for Use in Electronic Equipment - Part 1: Generic Specification | |
| Fixed Resistors for Use in Electronic Equipment \x96 Part 1: Generic Specification | |
| Fixed Resistors for Use in Electronic Equipment \x96 Part 8: Sectional Specification - Fixed Surface Mount Resistors | |
| Fixed Resistors for Use in Electronic Equipment \x96 Part 9-1: Blank Detail Specification: Fixed Surface Mount Resistor Networks with Individually Measurable Resistors \x96 Assessment Level EZ | |
| Fixed Resistors for Use in Electronic Equipment \x96 Part 9: Sectional Specification: Fixed Surface Mount Resistor Networks with Individually Measurable Resistors | |
| Fixed Tantalum Capacitors with Non-Solid Electrolyte and Foil Electrode | |
| Fixed Tantalum Capacitors with Non-Solid Electrolyte and Porous Anode | |
| Fixed Tantalum Capacitors with Solid Electrolyte and Porous Anode with Radial Leads | |
| Fixed Tantalum Capacitors with Solid Electrolyte and Porous Anode with Wire Lead Terminals Hermetically Sealed, Axial Lead, Polarized, Insulated | |
| Fixed Tantalum Capacitors with Solid Electrolyte and Porous Anode with Wire Lead Terminals Polar, Axial Leaded, Molded, Non-Hermetically Sealed | |
| Fixed Tantalum Capacitors with Solid Electrolyte and Porous Anode with Wire Lead Terminals Rectangular, Subminiature, Non-Hermetically Sealed, Plastic Encapsulated, Polarized, Insulated, Radial Lead | |
| Fixed Tantalum Capacitors with Solid Electrolyte and Porous Anode with Wire Lead Terminals | |
| FIXED TANTALUM CAPACITORS | |
| Fixed Tantalum Chip Capacitor Style 1 Protected (Molded) | |
| Fixed Tantalum Chip Capacitor Style 1 Protected - Extended Capacitance Range | |
| Fixed Tantalum Chip Capacitor Style 1 Protected-Standard Capacitance Range | |
| FOTP-14 Fiber Optic Shock Tests (Specified Pulse) | |
| FOTP-167 Mode Field Diameter, Variable Aperture in the Far Field | |
| FOTP-170 Cable Cutoff Wavelength of Single-Mode Fiber by Transmitted Power | |
| FOTP-185 Strength of Coupling Mechanism for Fiber Optic Interconnecting Devices | |
| FOTP-189 Ozone Exposure Test for Fiber Optic Components | |
| FOTP-42 Optical Crosstalk in Fiber Optic Components | |
| FOTP-48 Measurement of Optical Fiber Cladding Diameter Using Laser-Based Instruments | |
| FOTP-49 Procedure for Measuring Gamma Irradiation Effects in Optical Fiber and Optical Cables | |
| FOTP-5 Humidity Test Procedure for Fiber Optic Connecting Devices | |
| FOTP-58 Core Diameter Measurement of Graded-Index Optical Fibers | |
| FOTP-59 Measurement of Fiber Point Defects Using an OTDR | |
| FOTP-60 Measurement of Fiber or Cable Length Using an OTDR | |
| FOTP-61 Measurement of Fiber or Cable Attenuation Using an OTDR | |
| FOTP-63 Torsion Test for Optical Fiber | |
| FOTP-96 Fiber Optic Cable Long-Term Storage Temperature Test for Extreme Environments | |
| General Procedure for Capability Approval of Electronic Components | |
| General Resistor Stress Test Qualification Specification | |
| Generic Specification for Sockets for Use in Electronic Equipment | |
| GLOSSARY OF ELECTRICAL CONNECTOR RELATED TERMS | |
| Grounding and Bonding Guideline | |
| Grounding Installation Details | |
| Guideline for Reel Configuration and Dimensions for Reel Diameters Larger Than 360 mm (Utilized in Applications of 16 mm to 56 mm Carrier Taping) | |
| Guideline on the Use and Application of Cpk | |
| Guideline Orientation Standard for Multi-Connection Package (Design Rules for Tape and Reel Orientation) | |
| Guidelines for Power Systems Analysis | |
| Guidelines for Selecting IEEE and API Standards for AC Motors 250 HP (185 kW) and Larger | |
| Harmonizing CALS Product Data Description Standards | |
| High Definition TV Analog Component Video Interface | |
| High Speed 25-Position Interface for Data Terminal Equipment and Data Circuit-Terminating Equipment | |
| Information security management | |
| Integrated Passive Device (IPD) Chipscale Package Design Guidelines | |
| Interface between Data Circuit-Terminating Equipment (DCE) and the Public Switched Telephone Network (PSTN) | |
| International and National Quality Standards Index | |
| International Electrotechnical Vocabulary \x96 Part 192: Dependability | |
| Introduction to EDIF, Volume 1 | |
| IPD APPLICATION GUIDELINE (TERMINATION TECHNIQUES) | |
| Labeling Specification for Product and Shipment Identification in the Electronics Industry - 2D Barcode (Including Human Readable and 1D Barcode) | |
| Library of Parameterized Modules (LPM) | |
| LIGHT CURTAINS AND PRESENCE-SENSING DEVICES FOR MACHINE SAFEGUARDING | |
| Lighting and Receptacle Installation Details for Class I, Division 2, Class II, Division 2, and Unclassified Areas | |
| Lightning and Static Protection Guideline | |
| Line 21 Data Services | |
| Linear Bar Code and Two-Dimensional Symbols for the Labeling of Product Packages | |
| Lot Acceptance Procedure for Verifying Compliance with the Specified Quality Levels (SQL) in PPM | |
| LOW VOLTAGE SUPPLEMENTAL FUSE QUALIFICATION SPECIFICATION | |
| Magnetic Recorder Combined with Home Radio Receivers | |
| Mathematical Expressions for Reliability, Availability, Maintainability and Maintenance Support Terms | |
| Measurement of Electromagnetic Interference Characteristics of Equipment Intended to Operate in Severe Electromagnetic Environments | |
| Mechanically-Interlo cked Component Packaging Flat Carrier | |
| Mechanically-Interlo cked Component Packaging for Automatic Handling | |
| Mechanically-Interlo cked Component Packaging | |
| Method of Measurement of Non-Linearity in Resistors | |
| Method Selection for Assessment of Nonconforming Levels in Parts Per Million (PPM) | |
| Methods for Product Accelerated Testing | |
| Microgrid Design Criteria | |
| Microphones for Sound Equipment | |
| Miniature Aluminum Electrolytic Capacitor (Leaded) Qualification Specification | |
| MINIMUM STANDARDS FOR LAND MOBILE COMMUNICATION FM OR PM RECEIVERS, 25-866 MHz | |
| Minimum Standards for Portable/Personal Radio Transmitters, Receivers and Transmitter/Receiver Combination Land Mobile Communications FM or PM Equipment 25 - 1000 MHz | |
| Mobile Electronics Wiring Designations for Audio and Vehicle Security | |
| Mobile Station - Land Station Compatibility Specification | |
| Model for Integrating Metrics into the Procurement Process | |
| Molded Tantalum Chip Capacitor with Polymer Cathode | |
| Motor Installation Details | |
| Multilayer Chip Inductor Qualification Specification | |
| National Electronic Process Certification Standard | |
| NEMA Position Paper on Electronic Labeling | |
| Network Channel Terminal Equipment for DS1 Service | |
| Network Layer Conformance Specification | |
| Node Application Layer Specification | |
| Node Network Layer Specification | |
| Norma para Alambrado de Telecomunicaciones en Residencias y Edificios Comerciales Pequeinos | |
| Norma para Vias de Telecomunicaciones y Espacios en Edificios Comerciales | |
| Overall Electrical One-Line Diagram Guideline | |
| Packaging Material Standards for ESD Sensitive Items | |
| Power Law Model - Goodness-of- Fit Tests and Estimation Methods | |
| Procedures for Automatic Interworking Between Automode Modems and Modems Conforming to Recommendations V.32, V.22bis, and V.22 | |
| Process Improvement Guidelines | |
| Processes for Engineering a System | |
| Procurement Quality of Solid State Components by Government Contractors | |
| Product Life Cycle Data Model | |
| PROGRAMMABLE CONTROLLERS - APPLICATIONS | |
| PROGRAMMMABLE CONTROLLERS - REQUIREMENTS | |
| Programs for Reliability Growth | |
| Qualification Specification for Die Level Networks with Solder Bump Interconnects | |
| Quality System Assessment | |
| RADIO CONTROLS FOR CRANES | |
| Reality Block Diagrams | |
| Recommended Minimum Performance Standards of 800 MHz Dual Mode Mobile Stations | |
| Recommended Minimum Standards for 800-MHz Cellular Subscriber Units | |
| Recommended Practice for Line 21 Data Service | |
| Reliability Growth - Statistical Test and Estimation Methods | |
| Reliability Testing - Compliance Tests for Constant Failure Rate and Constant Failure Intensity | |
| Requirements for an Electronic Components Management Plan | |
| Requirements for Private Branch Exchange (PBX) Switching Equipment | |
| Requirements for the Control of Electromagnetic Interference Emissions and Susceptibility Characteristics of Equipment Intended to Operate in Severe Electromagnetic Environments | |
| Requirements Guide for Space Grade Electrical Connectors | |
| Resistance to Soldering Heat Test Procedure for Wire and Electrical Components | |
| Resistors, Rectangular, Surface Mount General Purpose | |
| Resistors, Rectangular, Surface Mount Precision | |
| Resistors, Thick Film Rectangular SMD on Ceramic | |
| Resistors, Thick Film Resistor Array on Ceramic | |
| Resistors, Thin Film Array on Silicon - Molded | |
| Resistors, Thin Film Rectangular SMD on Ceramic | |
| RF Transmission Line and Connector Selection Guide | |
| Rigid Coaxial Transmission Lines 50 Ohms | |
| Rigid Coaxial Transmission Lines and Connectors, 75 Ohms | |
| Sectional Specification for Battery Holders for Use in Electronic Equipment | |
| Sectional Specification for Burn-In Sockets for Use in Electronic Equipment | |
| Sectional Specification for Field Portable Polishing Devices for Preparation of Optical Fibers | |
| Sectional Specification for Multi-Package Module Sockets for Use in Electronic Equipment | |
| Sectional Specification for Nonpressurized Fiber Optic Splice Closures | |
| Sectional Specification for Type FSMA Connectors | |
| Sectional Specification Sockets for Relays for Use in Electronic Equipment | |
| Service Selection Information for Digital Storage Media Interoperability | |
| Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires | |
| Solid State Relays, EIA/NARM Standard for | |
| Solid Tantalum Capacitor Application Guideline | |
| Sound Systems | |
| SPECIFICATION FOR DIMENSIONS AND CONNECTORS LOCATIONS OF SMALL FORM FACTOR 45 MILLIMETER (1.8 INCH) DISK DRIVE | |
| Specification for M12 Hybrid (Data and Power) Circular Connectors | |
| Specification for M12 Power Circular Connectors | |
| Specification for Micro Serial Attachment 3 Gbs 4X Unshielded Connector | |
| Specification for Mini Multilane 10 Gb/s 4X Common Element Connectors | |
| Specification for Mini Multilane 12 Gbs 12X Shielded Connector | |
| Specification for Mini Multilane 4X Shielded Shell and Plug Connectors | |
| Specification for Mini Multilane 4X Unshielded Shell and Plug Connectors | |
| SPECIFICATION FOR PARALLEL 1.8 INCH DRIVE FORM FACTOR (78 MILLIMETER X 54 MILLIMETER | |
| Specification for QSFP+ 10 Gb/s Pluggable Transceiver | |
| Specification for Serial Attachment 3 Gbs 2X Unshielded Connector | |
| Specification for Small Form Factor 133.35 mm (5.25 in) Disk Drives | |
| Specification for Small Form Factor 33.0 mm (1.3 in) Disk Drives | |
| Specification for Small Form Factor 63.5 millimeters (2.5 inches) Disk Drives | |
| SPECIFICATION FOR SMALL FORM FACTOR 63.5 mm (2.5 inch) DISK DRIVES | |
| Specification for Small Form Factor 88.9 millimeters (3.5 inches) Disk Drives | |
| Specification for Small Form Factor 88.9 mm (3.5 in) Disk Drives | |
| Specification for Small Form Factor Power Connector Pin Dimensions | |
| Specification Policy Guide | |
| Standard Definition TV Analog Component Video Interface | |
| Standard for Plans to Determine Lead Content of Electronic Components and Related Equipment | |
| Standard for Preparing a COTS Assembly Management Plan | |
| Standard for Preparing an Electronic Components Management Plan | |
| Standard Optical Fiber Material Classes and Preferred Sizes | |
| Standard Test Method for Destructive Physical Analysis (DPA) of Ceramic Monolithic Capacitors | |
| Standard Test Procedure for Fiber Optic Fibers, Cables, Transducers, Sensors, Connecting and Terminating Devices, and Other Fiber Optic Components | |
| Standards of the Expansion Joint Manufacturers Association, Inc. - Includes one copy of Practical Guide to Expansion Joints | |
| Statistical Process Control Systems | |
| SURFACE MOUNT ALUMINUM ELECTROLYTIC CHIP CAPACITOR WITH POLYMER CATHODE (QUALIFICATION SPECIFICATION) | |
| SURFACE MOUNT COMMON MODE CHOKE QUALIFICATION SPECIFICATION | |
| Surface Mount Ferrite Chip Bead Qualification Specification | |
| Surface Mount Inductor Qualification Specification | |
| SURFACE MOUNT NIOBIUM AND TANTALUM CAPACITOR QUALIFICATION SPECIFICATION | |
| Surface Mount Tantalum Capacitor Qualification Specification | |
| SURGE WITHSTAND TELECOMMUNICATIONS FUSE QUALIFICATION SPECIFICATION | |
| Systems Engineering Capability Model Appraisal Method | |
| Systems Engineering Capability Model | |
| Systems Engineering | |
| Test Method - Electronic Passive Components Exposure to Atmospheric Sulfur | |
| Test Method for the Visual Inspection of Quartz Crystal Resonator Blanks | |
| Test Procedure for High Frequency Characterization of Low Inductance Multilayer Ceramic Chip Capacitors | |
| Testing and Measurement Methods for Audio Amplifiers | |
| The Evaluation of Losses in Conductors | |
| THICK FILM RESISTOR ARRAY SPECIFICATION | |
| Thick Film Resistor Specification | |
| THIN FILM ON CERAMIC RESISTOR ARRAY SPECIFICATION | |
| THIN FILM RC SPECIFICATION | |
| Thin Film Resistor Network Specification | |
| Tools, Crimping, Solderless Wiring Devices \x96 Recommended Procedures for User Certification | |
| TP-01B Acceleration Test Procedure for Electrical Connectors | |
| TP-06C Contact Resistance Test Procedure for Electrical Connectors | |
| TP-07C Contact Axial Concentricity Test Procedure for Electrical Connectors | |
| TP-105A ALTITUDE \x96 LOW TEMPERATURE TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | |
| TP-10D FLUID IMMERSION TEST PROCEDURE FOR ELECTRICAL CONNECTORS | |
| TP-10E FLUID IMMERSION TEST PROCEDURE FOR ELECTRICAL CONNECTORS | |
| TP-110 Thermal Cycling Test Procedure for Electrical Connectors and Sockets | |
| TP-11B RESISTANCE TO SOLVENTS TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | |
| TP-12A RESTRICTED ENTRY TEST PROCEDURE FOR ELECTRICAL CONNECTORS | |
| TP-13C Mating and Unmating Force Test Procedure for Electrical Connectors | |
| TP-13D MATING AND UNMATING FORCE TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | |
| TP-15A Contact Strength Test Procedure for Electrical Connectors | |
| TP-18B Visual and Dimensional Inspection Test Procedure for Electrical Connectors and Sockets | |
| TP-21C Insulation Resistance Test Procedure for Electrical Connectors, Sockets, and Coaxial Contacts | |
| TP-21D INSULATION RESISTANCE TEST PROCEDURE FOR ELECTRICAL CONNECTORS, SOCKETS, AND COAXIAL CONTACTS | |
| TP-22B Simulated Life Test Procedure for Electrical Connectors | |
| TP-23C LOW LEVEL CONTACT RESISTANCE TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | |
| TP-26B Salt Spray Test Procedure for Electrical Connectors, Contacts and Sockets | |
| TP-28E Vibration Test Procedure for Electrical Connectors and Sockets | |
| TP-29C Contact Retention Test Procedure for Electrical Connectors | |
| TP-32D Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors and Sockets | |
| TP-35B Insert Rentention Test Procedure for Electrical Connectors | |
| TP-36B Determination of Gas-Tight Characteristics Test Procedure for Electrical Connectors and/or Contact Systems | |
| TP-38B Cable Pull-Out Test Procedure for Electrical Connectors | |
| TP-39B Hydrostatic Test Procedure for Electrical Connectors, Contacts and Sockets | |
| TP-42B Impact Test Procedure for Electrical Connectors | |
| TP-43B Cable Clamping (Bending Moment) Test Procedure for Electrical Connectors | |
| TP-45 Connectors, Electrical, Firewall (Flame) Test Procedure | |
| TP-45 Flame Test Procedure for Firewall Electrical Connectors | |
| TP-45A Firewall Flame Test Procedure for Electrical Connectors | |
| TP-46B Microsecond Discontinuity Test Procedure for Electrical Connectors, Contacts and Sockets | |
| TP-48 Metallic Coating Thickness Measurements of Contacts Test Procedure for Electrical Connectors | |
| TP-50A Dust (Fine Sand) Test Procedure for Electrical Connectors | |
| TP-50B Dust (Fine Sand) Test Procedure for Electrical Connectors | |
| TP-53B Nitric Acid Vapor Test, Gold Finish Test Procedure for Electrical Connectors and Sockets | |
| TP-56-B Resistance to Soldering Heat Test Procedure for Electrical Connectors and Sockets | |
| TP-56C Resistance to Soldering Heat Test Procedure for Electrical Connectors and Sockets | |
| TP-56D RESISTANCE TO SOLDERING HEAT TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | |
| TP-59A Low Temperature Test Procedure for Electrical Connectors and Sockets | |
| TP-60A GENERAL METHODS FOR TESTING OF CONTACT FINISHES FOR ELECTRICAL CONNECTORS AND SOCKETS | |
| TP-70B TEMPERATURE RISE VERSUS CURRENT TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | |
| TP-75 Lightning Strike Test Procedure for Electrical Connectors | |
| TP-89A Space Application Test Procedure for Electrical Connectors and Sockets | |
| TP-91A Dust Test Procedure for Electrical Connectors and Sockets | |
| TP-91B Dust Test Procedure for Electrical Connectors and Sockets | |
| Transmission Parameters for a Mu-Law Compatible PBX (Digital Loss-Level Plan) | |
| Transport of Cable Channel Mapping System Information Using Extended Data Service (XDS) | |
| Transport of Internet Uniform Resource Locator (URL) Information Using Text-2 (T-2) Service | |
| Transport of Transmission Signal Identifier (TSID) Using Extended Data Service (XDS) | |
| TS-1000.01 Environmental Test Methodology for Assessing the Performance of Electrical Connectors and Sockets Used in Controlled Environment Applications | |
| Turntable Measurement Standard | |
| Two-Part High Density Blade and Backplane Tuning Fork Connector | |
| U.S. Region Rating Table (RRT) and Content Advisory Descriptor for Transport of Content Advisory Information Using ATSC A/65 Program and System Information Protocol (PSIP) | |
| Usable Screen Dimensions for Monochrome Display Tubes | |
| USER\x92S APPLICATION GUIDE TO FUSES | |
| User\xb4s Application Guide to Fuses | |
| Using EDIF 200 for Schematic Transfer | |
| VHN Home Network Specification | |
| Visual and Mechanical Inspection for Molded SMT Solid Tantalum Capacitors | |
| VISUAL AND MECHANICAL INSPECTION MULTILAYER CERAMIC CHIP CAPACITORS | |
| Weibull Analysis | |
| Zero Acceptance Number Sampling Procedures and Tables for Inspection by Attributes of a Continuous Manufacturing Process | |
| Zero Acceptance Number Sampling Procedures and Tables for Inspection by Attributes of Isolated Lots |
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