Jiangyin Deli Laser Solutions Co., Ltd. Datasheets for Laser Cutting and Welding Machines
Laser cutting machines and laser welding machines use a high-powered laser to cut or perforate materials in plate or sheet form.
Laser Cutting and Welding Machines: Learn more
| Product Name | Notes |
|---|---|
| Glass Cutting and Drilling System | Applications Thin Film Solar Cell Substrate FPD liquid crystal plate ITO Coated Glass Tempered Glass Backlight Glass Features Manual/Auto Loading/Unloading No Waste No need to Mill or Clean High Accuracy,... |
| Fully-Automatic Laser Cutting and Sorting System for FPC | Automatic dual-position laser processing Automatically loading from workpiece tray stack Automatic unloading of cut products onto tray Unloading trays are automatically arranged in a stack Automatically detects and skips cutting... |
| Fully-Automatic Dual-Head Laser Cutting System for Glass | Automatic dual-position processing Automatically loads from workpiece stack Automatic workpiece identification and sorting of material to be cut Automatic unloading module removes unwanted border pieces and transfers cut products onto... |
| Fully-Automatic Laser Marking System | Automatically adjusts loading mechanism to fit the size of the material Employs five sensors to ensure processing quality Linear motor for higher efficiency and stability Variety of laser source options... |
| Fully-Automatic Dual-Head Laser Cutting System for PCB | Dual-laser, dual-position automatic processing Automatically loading from workpiece tray stack Automatic sorting of individual cut pieces onto an unloading tray Automatic stacking of unloading trays Automatic detection of defective material... |
| UV Nanosecond Laser Micromachining System FP/FPS | Excellent laser beam quality to ensure long-run stability. High laser peak power; able to process all kinds of solid materials. Excellent processing flexibility; able to cut any shape. Narrow processing... |
| Laser System for Wafer Grooving AlGaInP | Fast scribing speeds; high yield rates; high production capacity Produces high-quality results with no residue or melt-back Fully-automatic processing; integrated coating application, wafer cutting, and cleaning functions Laser type: DPSS... |
| Laser Cutting System for Metals | High speed and high precision Simple and intuitive interface Rapid troubleshooting via comprehensive diagnostic system Rapid switching of assist gas Real time display of cutting status and current position |
| Fast Pico/ Femtosecond Laser Marking Machine | It is mostly used in high quality marking request, sometimes it's also one kind of anti- counterfeiting technology. It also can process ( drilling, scribing ) on different materials. Power:3W,10W30W60W... |
| Automatic Screen Glass Chamfer Laser Processing System - AGC20 | Material : Glass Work size: 400mm × 300mm, 1 ~ 12 inches applicable; Cutting Type: Fully Corresponding to Right Angle or R Angle Machining Equipment structure: 2 cutting heads +... |
| CO2 Laser Processing System for Ceramics | Non-contact processing reduces damage to the material and ensures high-precision cutting. Layer-by-layer cutting to meet the processing demands of different materials. Coaxial application of assist gas to protect the material... |
| Laser Cutting and Drilling System for Sapphire | Processable materials: A, C double crystal cast slice and non-cast slice Applications: Processes the entire outer shape and inner features of camera lenses, smartphone panels, and watch panels all at... |
| Vehicle-mounted LENS/G-Sensor/OGS Integrated Cutting and Drilling Solu | Product features Automatic loading and unloading material Process Flow: Loading → Laser drilling → Laser cutting → Automatic cracking → Sorting and unloading Processing size: 730mm×920mm (customizable) Thickness range: 0.55mm-1.5mm... |
| Picosecond Laser Micromachining System (DPS/DPD) | Technical Specification: Working area: 250mm×250mm (X-Y-axes) Power: 60/40/20W@1064nm (customizable) Wavelength: 1064/532/355nm Pulse width: <13ps Focal spot diameter: 10-25μm (adjustable) Maximum operating speed: 800mm/s(X-Y-axes); 20mm/sZ-axis Features: Excellent laser beam quality to... |
| Full-Automatic Flexible OLED Modules Laser Cutting System | This equipment, adopting the configurations of UV picosecond laser and galvanometer, together with the platform linkage technology, can achieve high-speed POL cutting. Excellent cutting quality, HAZ≤100um. Material being cut: POL... |
| UV Laser Cutting System for LGA/IC Materials | This FPC/PCB cutting system can be customized to suit your specific application requirements. It can handle a greater variety of products compared to the previous-generation model, and has established a... |