Jiangyin Deli Laser Solutions Co., Ltd. Datasheets for Laser Cutting and Welding Machines

Laser cutting machines and laser welding machines use a high-powered laser to cut or perforate materials in plate or sheet form.
Laser Cutting and Welding Machines: Learn more

Product Name Notes
Glass Cutting and Drilling System Applications Thin Film Solar Cell Substrate FPD liquid crystal plate ITO Coated Glass Tempered Glass Backlight Glass Features Manual/Auto Loading/Unloading No Waste No need to Mill or Clean High Accuracy,...
Fully-Automatic Laser Cutting and Sorting System for FPC Automatic dual-position laser processing Automatically loading from workpiece tray stack Automatic unloading of cut products onto tray Unloading trays are automatically arranged in a stack Automatically detects and skips cutting...
Fully-Automatic Dual-Head Laser Cutting System for Glass Automatic dual-position processing Automatically loads from workpiece stack Automatic workpiece identification and sorting of material to be cut Automatic unloading module removes unwanted border pieces and transfers cut products onto...
Fully-Automatic Laser Marking System Automatically adjusts loading mechanism to fit the size of the material Employs five sensors to ensure processing quality Linear motor for higher efficiency and stability Variety of laser source options...
Fully-Automatic Dual-Head Laser Cutting System for PCB Dual-laser, dual-position automatic processing Automatically loading from workpiece tray stack Automatic sorting of individual cut pieces onto an unloading tray Automatic stacking of unloading trays Automatic detection of defective material...
UV Nanosecond Laser Micromachining System FP/FPS Excellent laser beam quality to ensure long-run stability. High laser peak power; able to process all kinds of solid materials. Excellent processing flexibility; able to cut any shape. Narrow processing...
Laser System for Wafer Grooving AlGaInP Fast scribing speeds; high yield rates; high production capacity Produces high-quality results with no residue or melt-back Fully-automatic processing; integrated coating application, wafer cutting, and cleaning functions Laser type: DPSS...
Laser Cutting System for Metals High speed and high precision Simple and intuitive interface Rapid troubleshooting via comprehensive diagnostic system Rapid switching of assist gas Real time display of cutting status and current position
Fast Pico/ Femtosecond Laser Marking Machine It is mostly used in high quality marking request, sometimes it's also one kind of anti- counterfeiting technology. It also can process ( drilling, scribing ) on different materials. Power:3W,10W30W60W...
Automatic Screen Glass Chamfer Laser Processing System - AGC20 Material : Glass Work size: 400mm × 300mm, 1 ~ 12 inches applicable; Cutting Type: Fully Corresponding to Right Angle or R Angle Machining Equipment structure: 2 cutting heads +...
CO2 Laser Processing System for Ceramics Non-contact processing reduces damage to the material and ensures high-precision cutting. Layer-by-layer cutting to meet the processing demands of different materials. Coaxial application of assist gas to protect the material...
Laser Cutting and Drilling System for Sapphire Processable materials: A, C double crystal cast slice and non-cast slice Applications: Processes the entire outer shape and inner features of camera lenses, smartphone panels, and watch panels all at...
Vehicle-mounted LENS/G-Sensor/OGS Integrated Cutting and Drilling Solu Product features Automatic loading and unloading material Process Flow: Loading → Laser drilling → Laser cutting → Automatic cracking → Sorting and unloading Processing size: 730mm×920mm (customizable) Thickness range: 0.55mm-1.5mm...
Picosecond Laser Micromachining System (DPS/DPD) Technical Specification: Working area: 250mm×250mm (X-Y-axes) Power: 60/40/20W@1064nm (customizable) Wavelength: 1064/532/355nm Pulse width: <13ps Focal spot diameter: 10-25μm (adjustable) Maximum operating speed: 800mm/s(X-Y-axes); 20mm/sZ-axis Features: Excellent laser beam quality to...
Full-Automatic Flexible OLED Modules Laser Cutting System This equipment, adopting the configurations of UV picosecond laser and galvanometer, together with the platform linkage technology, can achieve high-speed POL cutting. Excellent cutting quality, HAZ≤100um. Material being cut: POL...
UV Laser Cutting System for LGA/IC Materials This FPC/PCB cutting system can be customized to suit your specific application requirements. It can handle a greater variety of products compared to the previous-generation model, and has established a...