Jiangyin Deli Laser Solutions Co., Ltd. Fully-Automatic Dual-Head Laser Cutting System for Glass

Automatic dual-position processing Automatically loads from workpiece stack Automatic workpiece identification and sorting of material to be cut Automatic unloading module removes unwanted border pieces and transfers cut products onto an unloading tray Unloading trays are automatically stacked in a collection fixture Fast cutting speeds Cuts ceramics without producing any discoloration Size of working area: 220mm*220mm*2 Applicable materials: ≤0.3mm thick ordinary glass with a <12μm thick ink coating layer; <0.3mm thick sapphire Processing speed: 4s/pc. for a φ10mm circular cut in 0.175mm thick ordinary glass with a black or white ink coating; 4s/pc. for a φ10mm circular cut in sapphire (dual-head cutting speed) Cutting precision: ±20μm Edge chipping: ≤10μm for glass, ≤20μm for sapphire, Sapphire cutting taper: <12° Applicable workpieces: This system is mainly used for the cutting of glass or ceramic cover plates for fingerprint identification modules Powerful customization capabilities allow it to be used for many other applications