Jiangyin Deli Laser Solutions Co., Ltd. Datasheets for Laser Engraving and Laser Marking Machines
Laser engraving and laser marking machines use a high-powered laser to mark or scribe materials with text, images, patterns, and graduations.
Laser Engraving and Laser Marking Machines: Learn more
| Product Name | Notes |
|---|---|
| Advantages: Single step operation 24hour/day and 7days/week reliable production with minimum maintenances No need of extra toxic and polluting materials High accuracy and good resolutions Very high process speed Features:... | |
| Fast cutting speeds; Pause-less cutting process; Stable performance; No consumables; High production capacity and yield rates; Greatly reduces operating costs. Laser type: DPSS 1064nm picosecond laser Laser power: ≥1W Cooling... | |
| Fast scribing speeds; High throughput; High-quality processing results; Significant improvements in yield rates; No consumables; Greatly reduces operating costs. Laser type: DPSS picosecond laser (532nm & 1064nm) Laser power: ≥1W... | |
| Large market share; State-of-the-art process; Experienced maintenance and technical support personnel Simple and practical equipment design – easy to disassemble and assemble for maintenance; Reduces maintenance costs Applicable materials: Ag,... | |
| Non-contact processing minimizes damage to the material. No consumables such as ink; reduces environmental impact. High yield rates from ultra-thin and large-size processing. Fast, flexible modification of screen printing. Working... | |
| Quick and convenient importing of processing graphics; able to process a variety of dotting forms. Easy modification of processing graphics; high processing precision. Model: LGP-ST Wavelength: 355nm-1064nm Average power: 15W... | |
| Specifications:Min scribing width: 20um Min hole-drilling dia.: 50um Positioning precision: 5um Repetition: 2um 3-axis working table system: 500mm×500mm×90mm Applicable materials: Stainless steel, Alloys Ceramics ( Alumina, AlN, etc.) Applications:SMT sheet... | |
| Technical Specifications for LTCC: Processable materials: low temperature co-fired ceramic (LTCC) Processing aperture: ≥20μm Processing precision: ±5μm Working area: 400mmX400mm Processing speed: 1000-2000 holes per second Technical Specification for Laser... | |
| This machine is mostly used for marking on keyboard, circuit and plastic material, and also can be used as a normal marking machine, with 3D processing system researched by Delphi,... | |
| This machine is mostly used for micro marking in Consumer electronics, semi-conduct medicine, especially for white plastic, vacuum deposition, glass, sapphire, and also for drilling cutting and etching on metals... | |
| Up to 800×600mm working area size Minimum line width of 1μm A variety of configurations to suit the demands of different jobs 3D exposure ability A variety of alignment methods... | |
| Uses roll-to-roll feeding and unloading for improved processing speeds and more efficient material usage High processing stability and yield rates Save on labor costs and improve production efficiency Technical Specifications... |