Jiangyin Deli Laser Solutions Co., Ltd. Datasheets for Marking and Engraving Equipment

Marking and engraving equipment marks or engraves products and packages with bar codes, lot codes, date stamps, graphics, labels, and other information. Marks are applied during the manufacturing process, eliminating the need to generate labels or papers for subsequent application.
Marking and Engraving Equipment: Learn more

Product Name Notes
Advantages: Single step operation 24hour/day and 7days/week reliable production with minimum maintenances No need of extra toxic and polluting materials High accuracy and good resolutions Very high process speed Features:...
Large market share; State-of-the-art process; Experienced maintenance and technical support personnel Simple and practical equipment design – easy to disassemble and assemble for maintenance; Reduces maintenance costs Applicable materials: Ag,...
Non-contact processing minimizes damage to the material. No consumables such as ink; reduces environmental impact. High yield rates from ultra-thin and large-size processing. Fast, flexible modification of screen printing. Working...
Quick and convenient importing of processing graphics; able to process a variety of dotting forms. Easy modification of processing graphics; high processing precision. Model: LGP-ST Wavelength: 355nm-1064nm Average power: 15W...
Specifications:Min scribing width: 20um Min hole-drilling dia.: 50um Positioning precision: 5um Repetition: 2um 3-axis working table system: 500mm×500mm×90mm Applicable materials: Stainless steel, Alloys Ceramics ( Alumina, AlN, etc.) Applications:SMT sheet...
Technical Specifications for LTCC: Processable materials: low temperature co-fired ceramic (LTCC) Processing aperture: ≥20μm Processing precision: ±5μm Working area: 400mmX400mm Processing speed: 1000-2000 holes per second Technical Specification for Laser...
This machine is mostly used for marking on keyboard, circuit and plastic material, and also can be used as a normal marking machine, with 3D processing system researched by Delphi,...
This machine is mostly used for micro marking in Consumer electronics, semi-conduct medicine, especially for white plastic, vacuum deposition, glass, sapphire, and also for drilling cutting and etching on metals...
Up to 800×600mm working area size Minimum line width of 1μm A variety of configurations to suit the demands of different jobs 3D exposure ability A variety of alignment methods...
Uses roll-to-roll feeding and unloading for improved processing speeds and more efficient material usage High processing stability and yield rates Save on labor costs and improve production efficiency Technical Specifications...