Jiangyin Deli Laser Solutions Co., Ltd. Datasheets for Laser Processing Equipment
Laser processing equipment uses high-powered lasers to cut, trim, perforate, weld, or join a variety of materials in plate or sheet form.
Laser Processing Equipment: Learn more
| Product Name | Notes |
|---|---|
| Advantages: Single step operation 24hour/day and 7days/week reliable production with minimum maintenances No need of extra toxic and polluting materials High accuracy and good resolutions Very high process speed Features:... | |
| Applications Thin Film Solar Cell Substrate FPD liquid crystal plate ITO Coated Glass Tempered Glass Backlight Glass Features Manual/Auto Loading/Unloading No Waste No need to Mill or Clean High Accuracy,... | |
| Automatic dual-position laser processing Automatically loading from workpiece tray stack Automatic unloading of cut products onto tray Unloading trays are automatically arranged in a stack Automatically detects and skips cutting... | |
| Automatic dual-position processing Automatically loads from workpiece stack Automatic workpiece identification and sorting of material to be cut Automatic unloading module removes unwanted border pieces and transfers cut products onto... | |
| Automatically adjusts loading mechanism to fit the size of the material Employs five sensors to ensure processing quality Linear motor for higher efficiency and stability Variety of laser source options... | |
| Dual-laser, dual-position automatic processing Automatically loading from workpiece tray stack Automatic sorting of individual cut pieces onto an unloading tray Automatic stacking of unloading trays Automatic detection of defective material... | |
| Excellent laser beam quality to ensure long-run stability. High laser peak power; able to process all kinds of solid materials. Excellent processing flexibility; able to cut any shape. Narrow processing... | |
| Fast cutting speeds; Pause-less cutting process; Stable performance; No consumables; High production capacity and yield rates; Greatly reduces operating costs. Laser type: DPSS 1064nm picosecond laser Laser power: ≥1W Cooling... | |
| Fast scribing speeds; high yield rates; high production capacity Produces high-quality results with no residue or melt-back Fully-automatic processing; integrated coating application, wafer cutting, and cleaning functions Laser type: DPSS... | |
| Fast scribing speeds; High throughput; High-quality processing results; Significant improvements in yield rates; No consumables; Greatly reduces operating costs. Laser type: DPSS picosecond laser (532nm & 1064nm) Laser power: ≥1W... | |
| High speed and high precision Simple and intuitive interface Rapid troubleshooting via comprehensive diagnostic system Rapid switching of assist gas Real time display of cutting status and current position | |
| It is mostly used in high quality marking request, sometimes it's also one kind of anti- counterfeiting technology. It also can process ( drilling, scribing ) on different materials. Power:3W,10W30W60W... | |
| Large market share; State-of-the-art process; Experienced maintenance and technical support personnel Simple and practical equipment design – easy to disassemble and assemble for maintenance; Reduces maintenance costs Applicable materials: Ag,... | |
| Material : Glass Work size: 400mm × 300mm, 1 ~ 12 inches applicable; Cutting Type: Fully Corresponding to Right Angle or R Angle Machining Equipment structure: 2 cutting heads +... | |
| Non-contact processing minimizes damage to the material. No consumables such as ink; reduces environmental impact. High yield rates from ultra-thin and large-size processing. Fast, flexible modification of screen printing. Working... | |
| Non-contact processing reduces damage to the material and ensures high-precision cutting. Layer-by-layer cutting to meet the processing demands of different materials. Coaxial application of assist gas to protect the material... | |
| Processable materials: A, C double crystal cast slice and non-cast slice Applications: Processes the entire outer shape and inner features of camera lenses, smartphone panels, and watch panels all at... | |
| Product features Automatic loading and unloading material Process Flow: Loading → Laser drilling → Laser cutting → Automatic cracking → Sorting and unloading Processing size: 730mm×920mm (customizable) Thickness range: 0.55mm-1.5mm... | |
| Quick and convenient importing of processing graphics; able to process a variety of dotting forms. Easy modification of processing graphics; high processing precision. Model: LGP-ST Wavelength: 355nm-1064nm Average power: 15W... | |
| Specifications:Min scribing width: 20um Min hole-drilling dia.: 50um Positioning precision: 5um Repetition: 2um 3-axis working table system: 500mm×500mm×90mm Applicable materials: Stainless steel, Alloys Ceramics ( Alumina, AlN, etc.) Applications:SMT sheet... | |
| Technical Specification: Working area: 250mm×250mm (X-Y-axes) Power: 60/40/20W@1064nm (customizable) Wavelength: 1064/532/355nm Pulse width: <13ps Focal spot diameter: 10-25μm (adjustable) Maximum operating speed: 800mm/s(X-Y-axes); 20mm/sZ-axis Features: Excellent laser beam quality to... | |
| Technical Specifications for LTCC: Processable materials: low temperature co-fired ceramic (LTCC) Processing aperture: ≥20μm Processing precision: ±5μm Working area: 400mmX400mm Processing speed: 1000-2000 holes per second Technical Specification for Laser... | |
| This equipment, adopting the configurations of UV picosecond laser and galvanometer, together with the platform linkage technology, can achieve high-speed POL cutting. Excellent cutting quality, HAZ≤100um. Material being cut: POL... | |
| This FPC/PCB cutting system can be customized to suit your specific application requirements. It can handle a greater variety of products compared to the previous-generation model, and has established a... | |
| This machine is mostly used for marking on keyboard, circuit and plastic material, and also can be used as a normal marking machine, with 3D processing system researched by Delphi,... | |
| This machine is mostly used for micro marking in Consumer electronics, semi-conduct medicine, especially for white plastic, vacuum deposition, glass, sapphire, and also for drilling cutting and etching on metals... | |
| Up to 800×600mm working area size Minimum line width of 1μm A variety of configurations to suit the demands of different jobs 3D exposure ability A variety of alignment methods... | |
| Uses roll-to-roll feeding and unloading for improved processing speeds and more efficient material usage High processing stability and yield rates Save on labor costs and improve production efficiency Technical Specifications... |