Thermon, Inc Datasheets for Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more
| Product Name | Notes |
|---|---|
| Flexible Heat Transfer Compound -- EFS-1 | EFS-1 is a preformed flexible heat transfer compound designed for use between plate-type external heating/ cooling coils and process vessels. Thermon’s heat transfer compounds provide an efficient thermal connection between... |
| Heat Transfer Compound -- NH Nonhardening | NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Thermon’s heat transfer compounds provide an efficient thermal connection between... |
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T-3 Heat Transfer Compound -- TFK-4
T-3 Heat Transfer Compound -- TFK-6 T-3 Heat Transfer Compound -- TFK-7 T-3 Heat Transfer Compound -- TFK-8 T-3 Heat Transfer Compound -- TFK-9 |
T-3 heat transfer compound creates an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single “Thermonized ™”steam tracer utilizing Thermon’s heat transfer compound... |
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Heat Transfer Compound -- T-85-1
Heat Transfer Compound -- T-85-5 Heat Transfer Compound -- T-85-C |
T-80 and T-85 are low to medium temperature heat transfer compounds for use in moist and corrosive environments. Thermon’s heat transfer compounds provide an efficient thermal connection between the tracer... |
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Heat Transfer Compound -- T-802-G
Heat Transfer Compound -- T-802-Q |
T-802 is a two-part low to medium temperature resin-based heat transfer compound for use in moist and corrosive environments. Thermon’s heat transfer compounds provide an efficient thermal connection between the... |
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Heat Transfer Compound -- TFK-4 SS
Heat Transfer Compound -- TFK-6 Heat Transfer Compound -- TFK-7 SS Heat Transfer Compound -- TFK-8 SS Heat Transfer Compound -- TFK-9 SS |
T-99 is a specialty heat transfer compound formulated to provide exceptional thermal stability and superior bonding strength up to 1832°F (1000°C). Maximum exposure temperature 1832°F (1000°C) |