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Hitachi High Technologies America, Inc. Datasheets for Wafer and Thin Film Instrumentation

Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing.
Wafer and Thin Film Instrumentation: Learn more

Product Name Notes
Conductor Etch System M-600/6000 Series is targeted for deep silicon trench etch of power devices used in mobile systems, home electrical appliances, automobiles, trains, etc. Low temperature etch technology and...
Conductor Etch System M-8000 Series is utilized for hard mask and silicon etching for 32nm and beyond. Hitachi High-Tech developed new process flows, such as double patterning and new material...
Next generation devices at 20nm and below require double-patterning, 3D (three-dimensional) structures, and complex, high-precision processes that include protective layer formation and finishing techniques for new materials. Hitachi High-Tech developed...
Next generation memories such as FeRAM (Ferroelectric Random Access Memory), ReRAM (Resistance Random Access Memory) and MRAM (Magnetoresistive Random Access Memory) require etching of novel non-volatile materials. However, by-product adhesion...
Rapid increases in aerial densities of HDD (Hard Disk Drive) requires advanced patterning solutions for thin film head production. This brings leading-edge semiconductor processes into the HDD industry as a...
The wafer surface inspection system LS series can detect defects on unpatterned wafers with a mirror-finished surface. Applied technology of laser scattering achieves high sensitivity and high throughput detection of...