Hitachi High Technologies America, Inc. Non-Volatile Materials Etch System E-600/8000 Series

Next generation memories such as FeRAM (Ferroelectric Random Access Memory), ReRAM (Resistance Random Access Memory) and MRAM (Magnetoresistive Random Access Memory) require etching of novel non-volatile materials. However, by-product adhesion inside of etch chamber causes significant productivity loss in volume production. Non-Volatile Materials Etch System E-600/8000 Series: the EMCP (Electro Magnetically Coupled Plasma) offers an outstanding solution to this problem ensuring constant high performance even for non-volatile material etch.