LPKF Laser & Electronics North America Datasheets for Laser Processing Equipment
Laser processing equipment uses high-powered lasers to cut, trim, perforate, weld, or join a variety of materials in plate or sheet form.
Laser Processing Equipment: Learn more
| Product Name | Notes |
|---|---|
| Laser Ablation with Virtually No Heat Input In laser technology, the shorter the pulse, the lower the heat input into the surrounding material. A picosecond laser breaks down an important... | |
| New Design The LPKF ProtoLaser S4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. Integration of the control PC is optional. Cost-Effectiveness... | |
| Universal Usability The LPKF ProtoLaser U4 uses a UV laser source. Many material groups are easy to process at these wavelengths – without additional tools, masks, or films. The LPKF... | |
| The LPKF ProtoLaser 3D was developed specifically for prototyping three-dimensional circuitry. System design is based on the proven ProtoLaser concept used for printed circuit board prototyping. The work platform has... | |
| The LPKF ProtoLaser S is a NIR laser with a 25 µm focused beam diameter developed for HF and microwave circuits, as well as digital and analog designs. Rapid surface... |