LPKF Laser & Electronics North America UV Laser Micromaterial Processing Machine ProtoLaser U4

Description
Universal Usability The LPKF ProtoLaser U4 uses a UV laser source. Many material groups are easy to process at these wavelengths – without additional tools, masks, or films. The LPKF ProtoLaser U4 builds on the success of its predecessor and expands its range of applications with targeted innovations. New Design The LPKF ProtoLaser U4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. The control PC is integrated into the ProtoLaser U4. Stabilization of the Low-Energy Range Delicate, sensitive processes do not require a lot of laser energy, but rather especially little. Multiple processing produces highly precise structures on sensitive substrates. The new UV laser source is now stabilized across a large performance range. It can now safely process additional material groups and thin layers. Process Tracking A new performance measuring field determines the actual laser performance in the focal position and displays it. Here, LPKF has met demands from customers who want exact actual data for documentation. Vision System The LPKF ProtoLaser U4 uses a newly designed vision system optimized for laser micro material processing. The camera and image recognition process probe any fiducials or geometric structures on the substrate to be processed. A higher resolution and faster detection algorithms accelerate the manufacturing process. Broad processing range due to UV laser Stabilized in the lower performance range Output measurement at substrate level
Description
Universal Usability The LPKF ProtoLaser U4 uses a UV laser source. Many material groups are easy to process at these wavelengths – without additional tools, masks, or films. The LPKF ProtoLaser U4 builds on the success of its predecessor and expands its range of applications with targeted innovations. New Design The LPKF ProtoLaser U4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. The control PC is integrated into the ProtoLaser U4. Stabilization of the Low-Energy Range Delicate, sensitive processes do not require a lot of laser energy, but rather especially little. Multiple processing produces highly precise structures on sensitive substrates. The new UV laser source is now stabilized across a large performance range. It can now safely process additional material groups and thin layers. Process Tracking A new performance measuring field determines the actual laser performance in the focal position and displays it. Here, LPKF has met demands from customers who want exact actual data for documentation. Vision System The LPKF ProtoLaser U4 uses a newly designed vision system optimized for laser micro material processing. The camera and image recognition process probe any fiducials or geometric structures on the substrate to be processed. A higher resolution and faster detection algorithms accelerate the manufacturing process. Broad processing range due to UV laser Stabilized in the lower performance range Output measurement at substrate level

Suppliers

Company
Product
Description
Supplier Links
UV Laser Micromaterial Processing Machine - ProtoLaser U4 - LPKF Laser & Electronics North America
Tualatin, OR, USA
UV Laser Micromaterial Processing Machine
ProtoLaser U4
UV Laser Micromaterial Processing Machine ProtoLaser U4
Universal Usability The LPKF ProtoLaser U4 uses a UV laser source. Many material groups are easy to process at these wavelengths – without additional tools, masks, or films. The LPKF ProtoLaser U4 builds on the success of its predecessor and expands its range of applications with targeted innovations. New Design The LPKF ProtoLaser U4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. The control PC is integrated into the ProtoLaser U4. Stabilization of the Low-Energy Range Delicate, sensitive processes do not require a lot of laser energy, but rather especially little. Multiple processing produces highly precise structures on sensitive substrates. The new UV laser source is now stabilized across a large performance range. It can now safely process additional material groups and thin layers. Process Tracking A new performance measuring field determines the actual laser performance in the focal position and displays it. Here, LPKF has met demands from customers who want exact actual data for documentation. Vision System The LPKF ProtoLaser U4 uses a newly designed vision system optimized for laser micro material processing. The camera and image recognition process probe any fiducials or geometric structures on the substrate to be processed. A higher resolution and faster detection algorithms accelerate the manufacturing process. Broad processing range due to UV laser Stabilized in the lower performance range Output measurement at substrate level

Universal Usability

The LPKF ProtoLaser U4 uses a UV laser source. Many material groups are easy to process at these wavelengths – without additional tools, masks, or films. The LPKF ProtoLaser U4 builds on the success of its predecessor and expands its range of applications with targeted innovations.

New Design

The LPKF ProtoLaser U4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. The control PC is integrated into the ProtoLaser U4.

Stabilization of the Low-Energy Range

Delicate, sensitive processes do not require a lot of laser energy, but rather especially little. Multiple processing produces highly precise structures on sensitive substrates. The new UV laser source is now stabilized across a large performance range. It can now safely process additional material groups and thin layers.

Process Tracking

A new performance measuring field determines the actual laser performance in the focal position and displays it. Here, LPKF has met demands from customers who want exact actual data for documentation.

Vision System

The LPKF ProtoLaser U4 uses a newly designed vision system optimized for laser micro material processing. The camera and image recognition process probe any fiducials or geometric structures on the substrate to be processed. A higher resolution and faster detection algorithms accelerate the manufacturing process.

  • Broad processing range due to UV laser
  • Stabilized in the lower performance range
  • Output measurement at substrate level
Supplier's Site

Technical Specifications

  LPKF Laser & Electronics North America
Product Category Laser Processing Equipment
Product Number ProtoLaser U4
Product Name UV Laser Micromaterial Processing Machine
Type Complete or Turnkey System
Options / Components Cabinet; Laser Optics or Beam Delivery Components; Laser head or focusing module
Automation / Control PC_Control
Laser Operation Drilling; Cutting
Workpiece Material Electronics / Wafers
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