LPKF Laser & Electronics North America Laser PCB Prototying Machine for Small Series ProtoLaser S4

Description
New Design The LPKF ProtoLaser S4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. Integration of the control PC is optional. Cost-Effectiveness Built In The ProtoLaser S4 is a valuable tool in the electronics lab. It can quickly and accurately generate fine structures and uses a special procedure for ablating large areas. The laser process requires no masks or tools to produce one-offs or individual marks. Expanded Process Window Switching to a green laser wavelength increases the range of applications. A green laser is much less likely to burn the substrate. It can also reliably machine inhomogeneous metal layers with up to 6 μm variance in Cu thickness - e. g., boards with fully metallized surfaces following galvanic via plating. The ProtoLaser S4 can cut and drill rigid or flexible substrates efficiently with thicknesses of up to ~1mm; thicker materials also allow drilling/cutting with additional laser passes. Vision System The LPKF ProtoLaser S4 has a newly designed fiducial recognition camera and image processing system that has been optimized for circuit board prototyping. A higher resolution and faster detection algorithms accelerate the manufacturing process. This camera allows the LPKF ProtoLaser S4 to visually inspect and properly align the workpiece. The LPKF ProtoLaser S4 laser system can laser etch PCBs in minutes on a wide range of laminated substrates, FR4 and PTFE or woven PCB materials. Prototypes and small production batches can also be produced on short notice if required. The system requires no chemicals and is easy to operate with LPKF CircuitPro software included.
Description
New Design The LPKF ProtoLaser S4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. Integration of the control PC is optional. Cost-Effectiveness Built In The ProtoLaser S4 is a valuable tool in the electronics lab. It can quickly and accurately generate fine structures and uses a special procedure for ablating large areas. The laser process requires no masks or tools to produce one-offs or individual marks. Expanded Process Window Switching to a green laser wavelength increases the range of applications. A green laser is much less likely to burn the substrate. It can also reliably machine inhomogeneous metal layers with up to 6 μm variance in Cu thickness - e. g., boards with fully metallized surfaces following galvanic via plating. The ProtoLaser S4 can cut and drill rigid or flexible substrates efficiently with thicknesses of up to ~1mm; thicker materials also allow drilling/cutting with additional laser passes. Vision System The LPKF ProtoLaser S4 has a newly designed fiducial recognition camera and image processing system that has been optimized for circuit board prototyping. A higher resolution and faster detection algorithms accelerate the manufacturing process. This camera allows the LPKF ProtoLaser S4 to visually inspect and properly align the workpiece. The LPKF ProtoLaser S4 laser system can laser etch PCBs in minutes on a wide range of laminated substrates, FR4 and PTFE or woven PCB materials. Prototypes and small production batches can also be produced on short notice if required. The system requires no chemicals and is easy to operate with LPKF CircuitPro software included.

Suppliers

Company
Product
Description
Supplier Links
Laser PCB Prototying Machine for Small Series - ProtoLaser S4 - LPKF Laser & Electronics North America
Tualatin, OR, USA
Laser PCB Prototying Machine for Small Series
ProtoLaser S4
Laser PCB Prototying Machine for Small Series ProtoLaser S4
New Design The LPKF ProtoLaser S4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. Integration of the control PC is optional. Cost-Effectiveness Built In The ProtoLaser S4 is a valuable tool in the electronics lab. It can quickly and accurately generate fine structures and uses a special procedure for ablating large areas. The laser process requires no masks or tools to produce one-offs or individual marks. Expanded Process Window Switching to a green laser wavelength increases the range of applications. A green laser is much less likely to burn the substrate. It can also reliably machine inhomogeneous metal layers with up to 6 μm variance in Cu thickness - e. g., boards with fully metallized surfaces following galvanic via plating. The ProtoLaser S4 can cut and drill rigid or flexible substrates efficiently with thicknesses of up to ~1mm; thicker materials also allow drilling/cutting with additional laser passes. Vision System The LPKF ProtoLaser S4 has a newly designed fiducial recognition camera and image processing system that has been optimized for circuit board prototyping. A higher resolution and faster detection algorithms accelerate the manufacturing process. This camera allows the LPKF ProtoLaser S4 to visually inspect and properly align the workpiece. The LPKF ProtoLaser S4 laser system can laser etch PCBs in minutes on a wide range of laminated substrates, FR4 and PTFE or woven PCB materials. Prototypes and small production batches can also be produced on short notice if required. The system requires no chemicals and is easy to operate with LPKF CircuitPro software included.

New Design

The LPKF ProtoLaser S4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. Integration of the control PC is optional.

Cost-Effectiveness Built In

The ProtoLaser S4 is a valuable tool in the electronics lab. It can quickly and accurately generate fine structures and uses a special procedure for ablating large areas. The laser process requires no masks or tools to produce one-offs or individual marks.

Expanded Process Window

Switching to a green laser wavelength increases the range of applications. A green laser is much less likely to burn the substrate. It can also reliably machine inhomogeneous metal layers with up to 6 μm variance in Cu thickness - e. g., boards with fully metallized surfaces following galvanic via plating. The ProtoLaser S4 can cut and drill rigid or flexible substrates efficiently with thicknesses of up to ~1mm; thicker materials also allow drilling/cutting with additional laser passes.

Vision System

The LPKF ProtoLaser S4 has a newly designed fiducial recognition camera and image processing system that has been optimized for circuit board prototyping. A higher resolution and faster detection algorithms accelerate the manufacturing process. This camera allows the LPKF ProtoLaser S4 to visually inspect and properly align the workpiece.

The LPKF ProtoLaser S4 laser system can laser etch PCBs in minutes on a wide range of laminated substrates, FR4 and PTFE or woven PCB materials. Prototypes and small production batches can also be produced on short notice if required. The system requires no chemicals and is easy to operate with LPKF CircuitPro software included.

Supplier's Site

Technical Specifications

  LPKF Laser & Electronics North America
Product Category Laser Processing Equipment
Product Number ProtoLaser S4
Product Name Laser PCB Prototying Machine for Small Series
Type Complete or Turnkey System
Options / Components Cabinet; Laser Optics or Beam Delivery Components; Laser head or focusing module
Automation / Control PC_Control
Laser Operation Drilling; Cutting
Workpiece Material Electronics / Wafers
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