Laser Ablation with Virtually No Heat Input
In laser technology, the shorter the pulse, the lower the heat input into the surrounding material. A picosecond laser breaks down an important barrier. It practically eliminates heat transfer; the targeted material evaporates immediately.
Proven Housing
The new ProtoLaser R is packaged in the familiar third generation ProtoLaser system housing. It is structurally decoupled from the effects of the environment and can be rolled through any lab door.
Micro-Material Processing Specialist
Unlike pure cutting applications, micro material processing does not require high powers. Instead, stable laser parameters in the lower output range are crucial. The LPKF ProtoLaser R features a laser source with a laser power of up to 4 W. This allows even complex thin film systems, temperature-sensitiv
ee substrates, and OLED coatings on glass to be ablated or structured with a high degree of control. The laser system requires no masks or films to accomplish these tasks.
Established System Software
The LPKF ProtoLaser R comes with tried and true system software. Support of all common CAD formats is enabled through the combination of LPKF CircuitPro and LPKF CircuitMaster.
Picosecond laser for the research lab
Cold ablation of different thin-film-layers
Intuitive CAM software
Field-proven housing concept
Laser Ablation with Virtually No Heat Input
In laser technology, the shorter the pulse, the lower the heat input into the surrounding material. A picosecond laser breaks down an important barrier. It practically eliminates heat transfer; the targeted material evaporates immediately.
Proven Housing
The new ProtoLaser R is packaged in the familiar third generation ProtoLaser system housing. It is structurally decoupled from the effects of the environment and can be rolled through any lab door.
Micro-Material Processing Specialist
Unlike pure cutting applications, micro material processing does not require high powers. Instead, stable laser parameters in the lower output range are crucial. The LPKF ProtoLaser R features a laser source with a laser power of up to 4 W. This allows even complex thin film systems, temperature-sensitivee substrates, and OLED coatings on glass to be ablated or structured with a high degree of control. The laser system requires no masks or films to accomplish these tasks.
Established System Software
The LPKF ProtoLaser R comes with tried and true system software. Support of all common CAD formats is enabled through the combination of LPKF CircuitPro and LPKF CircuitMaster.
- Picosecond laser for the research lab
- Cold ablation of different thin-film-layers
- Intuitive CAM software
- Field-proven housing concept
