LPKF Laser & Electronics North America Ultra-fast, Advanced PCB Laser Etching Machine ProtoLaser S

The LPKF ProtoLaser S is a NIR laser with a 25 µm focused beam diameter developed for HF and microwave circuits, as well as digital and analog designs. Rapid surface metal removal is achieved with an LPKF developed laser delamination process or with ablation settings. A wide range of substrates can be processed included copper-clad FR4, aluminum-coated PET films, ceramics, Rogers TMM®, RT/duroid®, RO4000® and PTFE based materials up to 9" x 12" in size. Precise alignment for double-sided prototypes is achieved with an included fiducial recognition camera. This camera allows the LPKF ProtoLaser S to visually inspect and properly align the material. Circuit traces as small as 100 µm (4 mil) can be achieved with laminated PCB materials and 50 µm traces can be achieved, along with spacing of 25 µm when working with ceramics. Smaller features may be possible and results are dependent on copper/metal thickness, substrate type and peel strength. For drilling through-holes in printed circuit boards, an LPKF ProtoMat system is a perfect complement to the LPKF ProtoLaser S.