Daitron Co., Ltd. Datasheets for Grinders and Grinding Machines
Grinders and grinding machines use an abrasive that is bonded to a wheel, belt or disc to remove material and improve surface finish.
Grinders and Grinding Machines: Learn more
| Product Name | Notes |
|---|---|
| The chip testers pick up laser diode chips on a sheet, measure and evaluate various characteristics, and sort them based on the results. The measurement stages are equipped with the... | |
| The cleaving machines automatically perform parallel alignment and positioning and cleave with the blade the silicon substrates and compound semiconductor substrates, such as GaAs, InP, and GaN, from the scribed... | |
| The scribe machines automatically perform parallel alignment and positioning and scribe silicon substrates and compound semiconductor substrates, such as GaAs, InP, and GaN. It is capable for processing maximum of... | |
| The visual inspection machines capture high-definition images of semiconductor products and transparent objects such as glass and perform the measurements for scratches, particulates and debris, chipping, color unevenness, dimensions of... | |
| The wafer edge grinders are designed to grind edge and circumference of a wide variety of wafers including silicon, compound semiconductors, such as, SiC, GaN, GaAs, and InP, oxide wafers,... |